IC Design
Comprehensive coverage of the challenges IC designers face, the most significant technologies produced by providers of EDA (electronic design automation) tools and IP (intellectual property) cores, and the design methodologies other IC designers are using to become successful.
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Long shots, short shots, and hip shots
Vance Harwood, consultant, May 10, 2012Production of one company's new automatic-test systems screeched to a halt when a simple self-test for the driver output’s path resistance started intermittently failing. What was the cause? More -
Do new technologies ease small-scale product innovation?
Bill Schweber, Contributing Technical Editor, May 10, 2012PC-based simulation and tools, manufacturing setups, and production equipment mean that it is easier to develop lower-volume products. More -
Remote display technology lets users fully experience cloud content
Raj Pawate, Distinguished member, Technical Staff, Texas Instruments Incorporated, May 9, 2012The cloud can provide content almost anywhere, anytime. Often, however, the device where the content ends up is not ideal for viewing, sharing and experiencing it. Remote display technology provides an effective path around this dilemma. More -
High-performance HF transceiver design: A ham's perspective
Doug Grant, May 3, 2012Designers of equipment for radio amateurs face the same problems as designers of most other systems - squeezing the last dB of performance from off-the-shelf components. Some ingenious designs have evolved, using analog, digital and DSP technology. More -
Understanding the basics of setup and hold time
Deepak Behera, Karthik Rao C.G. and Deepak Mahajan, Freescale Semiconductor, April 19, 2012Setup and hold times are treated as intrinsic properties of an element. However, it is the very existence of setup and hold time that often confuses us. Here are the cause of setup and hold time within a sequential element (flip-flop) and a look at the operation of the flop. More -
EMI problems? Part three: strength of EMI-radiated signals
Bonnie Baker, Texas Instruments, April 19, 2012Now that we have identified EMI sources we are going to see what happens as the signals are radiated towards your boards. More -
Sage words of advice from Forte Design Systems founder John Sanguinetti
Interview conducted and edited by Brian Bailey, April 19, 2012John Sanguinetti, the founder and chief technology officer of Forte Design Systems, is an inventor, an entrepreneur, a cancer survivor, and an interesting guy. EDN spoke with him during the recent 2012 Design and Verification Conference in San Jose, CA. More -
New power semiconductor technologies challenge assembly and system setups
Dr. Gerhard Miller, Infineon Technologies, Neubiberg Am Campeon, Germany, April 16, 2012While power density and performance rise, higher current densities require operating temperatures up to 200° C and faster switching to prevent losses, assemblies and system setups can't cope. Taking advantage of improved electrical properties requires thermal and electrical assembly technologies featuring very low stray inductances with a 10x to 20x better load-cycling capability at a higher temperature swing. More -
Samplify solutions transform processing paradigms at DESIGN West 2012
Steve Taranovich, Senior Technical Editor, April 12, 2012Samplify Systems Inc, a provider of IP solutions, improves multicore I/O bottlenecks/cloud computing (heading off the multicore memory wall), consumer electronics, mobile devices, and supercomputer capacity. More -
Optically isolating an I2C interface: Beware of nonlinear propagation delays
Eric D. Blom, Senior Design Engineer, IXYS-Clare Inc., April 3, 2012The usual model of an I2C open-drain bus as a simple, shared pull-up resistor is not instantaneously valid when using bus isolators exhibiting real-world propagation delays. If the delays are not considered in the design of the hardware, then there can be unexpected consequences. More
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Practical Chip Design
May 16, 2012
Modeling in layers results in increased productivity
Productivity is related to the way in which we can model something and reliably go...
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Practical Chip Design
May 2, 2012
Top-down analog flows. Myth or reality?
There are very few designs these days that are not mixed-signal, meaning that...
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In my younger days, the father of my friend was a ham with a full Collins...
Earl Dolnick, W6JWN– 2012-16-5 15:20:56 PDT
in response to High-performance HF transceiver design: A ham's perspectiveIn my younger days, the father of my friend was a ham with a full Collins...
Earl Dolnick, W6JWN– 2012-16-5 15:20:55 PDT
in response to High-performance HF transceiver design: A ham's perspectivePlease note that the formulas have been corrected with the on-line version of...
Bonnie Baker– 2012-15-5 10:35:09 PDT
in response to EMI problems? Part three: strength of EMI-radiated signals
KNOWLEDGE CENTER
Product fEEd
EDN's technical editors highlight notable new products including analog and digital ICs, power components, sensors, passives, boards and systems, software, and more.
IXYS-Clare CPC1540 solid-state relay: Solid-state relay features thermal shutdown
NKK Switches YB2 pushbutton switches: Devices have short above-panel dimension
E-Switch KJD17 pushbutton switch: Heavy-duty series of switches offer safety protection
C&K Components RB-4G0124 and RB-231 switches: Rolling-ball tilt switches control safety
Knitter-Switch MMP/MMS 1263 switches: Switches feature automatic-return slider
AVX StaticGuard varistors: Automotive varistors have low leakage current
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Taking the Measure
Rick Nelson, editorial director of Test & Measurement World, comments on test, globalization, measurement, machine vision, economics, nanotechnology, the engineering profession, and more.
Latest Post: September 12, 2011
After more than 13 years at T&MW, I have decided to move on to a new position, but T&MW will be in good hands. Read More
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