• Do new technologies ease small-scale product innovation?

  Bill Schweber, Contributing Technical Editor, May 10, 2012
  PC-based simulation and tools, manufacturing setups, and production equipment mean that it is easier to develop lower-volume products.  More

• New power semiconductor technologies challenge assembly and system setups

  Dr. Gerhard Miller, Infineon Technologies, Neubiberg Am Campeon, Germany, April 16, 2012
  While power density and performance rise, higher current densities require operating temperatures up to 200° C and faster switching to prevent losses, assemblies and system setups can't cope. Taking advantage of improved electrical properties requires thermal and electrical assembly technologies featuring very low stray inductances with a 10x to 20x better load-cycling capability at a higher temperature swing.  More

• Printed electronics memory: challenges of logic and integration

  Jennifer Ernst, Thin Film Electronics ASA, April 9, 2012
  With printed electronic memory now commercially available, the next phase for building the ecosystem will be adding logic to enable new applications.  More

• Adapteva close to sampling 28-nm, 64-core coprocessor

  Peter Clarke, EE Times, March 19, 2012
  Adapteva, a small and lean fabless startup that has developed a series of multicore floating-point processors, claims its latest device, a 28-nm 64-core processor is close to sampling.  More

• Chip startup funding up 237% in February, says GSA

  Peter Clarke, EE Times, March 19, 2012
  It may not be that the tide has turned in semiconductor startup funding but February caught a big wave of venture capital money, according the Global Semiconductor Alliance (GSA) industry organization.  More

• Swedish spin-off offers graphene-on-SiC

  Peter Clarke, EE Times, March 12, 2012
  Graphensic AB has been formed by researchers Professor Rositza Yakimova, Mikael Syvajarvi, and Tihomir Iakimov as a spin-off from the Linkoping University, to commercialize the formation of graphene on hexagonal silicon carbide.  More

• Hard mask development taps use of nanocrystals

  Nicolas Mokhoff, EE Times, March 7, 2012
  Pixelligent, a provider of nanocrystal additives, and Brewer Science are using their nanocrystal and microelectronic coating technologies to create a next-generation spin-on hard mask for semiconductor lithography processes.  More

• IMEC offers 14-nm dev kit, test chip to follow 2H12

  Peter Clarke, EE Times, March 6, 2012
  The kit includes support for a number of technologies that are likely to be required at the 14-nm node including FinFET devices and extreme ultraviolet lithography.  More

• AMD relinquishes stake in Globalfoundries

  Dylan McGrath, EE Times, March 5, 2012
  Advanced Micro Devices Ihas agreed to relinquish its remaining 14% stake in Globalfoundries and to pay Globalfoundries $425 million as part of an amended foundry supply agreement between the two firms that will enable AMD to use another foundry provider at the 28-nm node.  More

• Luxtera, ST in deal to take silicon photonics mainstream

  Peter Clarke, EE Times, March 1, 2012
  STMicroelectronics has agreed with CMOS photonics specialist Luxtera to develop a dedicated silicon photonics process at its 300-mm research and pilot production wafer fab in Crolles, France.  More

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