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<channel><title>EDN - Press Releases</title>
 <description>The internet Home of Electronic News, EDN, Electronic Business</description>
 <language>en-us</language>
 <link>http://www.edn.com</link>
 <copyright>Copyright 2009 Reed Business Information.  Subject to its &lt;A href="http://www.edn.com/index.asp?layout=siteInfo&amp;doc_id=26250"&gt;Terms of Use&lt;/A&gt;</copyright>
 <pubDate>Fri, 27 Nov 2009 01:08:36 PST</pubDate>

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<title>4ipnet Unveils EAP300 3x3 MIMO 11n Access Point with Proprietary Press-n-Connect Technology</title>
<link>http://www.edn.com/pressRelease/2140485184.html?nid=3375</link>
<description>Not just a standard 11n access point: 4ipnet EAP300 is empowered by 4ipWES (Press-n-Connect) technology; to establish a connection between two of more access points are just a few steps. The dual-band EAP300 can operate on PoE and targets customers in need of wireless solutions to replace traditional Ethernet networks.</description>
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<title>FCI Offers Pwr Profile+&amp;#8482; Cable Assemblies for  Low-Profile Power Applications</title>
<link>http://www.edn.com/pressRelease/2140485194.html?nid=3375</link>
<description>FCI, a leading developer of connectors and interconnect systems, announces Pwr Profile+&amp;#8482; low profile I/O cable assemblies.</description>
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<title>Stackpole's Thin Film Resistors for Telecom Applications</title>
<link>http://www.edn.com/pressRelease/2140485197.html?nid=3375</link>
<description>Ideal for telecommunication applications, Stackpole Electronics' RNCP Series thin film resistors provide twice the normal power rating compared to standard thick film technology.</description>
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<title>NOVELLUS&amp;#161;&amp;#166; ASHABLE HARDMASK (AHM&amp;amp;#8482;) PECVD FILMS ENABLE SUB-32nm LITHOGRAPHIC PATTERNING</title>
<link>http://www.edn.com/pressRelease/2140485303.html?nid=3375</link>
<description>Up to 7 Percent Device Yield Improvement Achievable Compared to Traditional Amorphous Carbon Films</description>
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<title>Power Integrations Releases New Version of PI Expert(R) Power Supply Design Software</title>
<link>http://www.edn.com/pressRelease/2140485327.html?nid=3375</link>
<description>Version 7.1.5 optimizes transformer design for improved efficiency, accurately calculates external resistor requirements, and includes traditional Chinese language support</description>
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<title>Ares introduces Oracle ERP for Taiwan IC design house UTC</title>
<link>http://www.edn.com/pressRelease/2140485329.html?nid=3375</link>
<description>Ares International Corp. has signed contract with Unisonic Technologies Company Limited (UTC), a major Taiwan-based supplier of high-tech semiconductor devices and IC design, for introducing Oracle ERP for the IC designer. The system is expected to go live next April.</description>
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<title>Fast cure, no mixing, superior performance encapsulant from Intertronics</title>
<link>http://www.edn.com/pressRelease/2140485337.html?nid=3375</link>
<description>Intertronics&amp;#8217; latest introduction to the world of electronic encapsulants is the Multi-Cure&amp;#174; 9001-E series which addresses the age old problems of time and mess/mixing with consummate success.</description>
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<title>ON Semiconductor Introduces GreenPoint&amp;#174; Reference Designs for High Efficiency LED Lighting Applications</title>
<link>http://www.edn.com/pressRelease/2140485338.html?nid=3375</link>
<description>Reference designs simplify development of MR16 format products and LED-based ENERGY STAR&amp;#174; residential luminaires</description>
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<title>Hirose Electric Develops FPC-to-Board Connectors with 0.6mm Stacking Height, 0.4mm Contact Pitch</title>
<link>http://www.edn.com/pressRelease/2140484964.html?nid=3375</link>
<description>Versatile connector features multiple stacking heights; highly reliable contact and retention force&amp;#8230;</description>
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<title>Hynix Standardizes on Magma's FineSim Pro and FineSim SPICE for Full-Chip Verification of Large Memory Designs</title>
<link>http://www.edn.com/pressRelease/2140484979.html?nid=3375</link>
<description>Advanced Circuit Simulation Products Proven to Deliver 4 Times Faster Performance Without Sacrificing Accuracy</description>
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<title>Magma's Quartz DRC and Quartz LVS Adopted by Toshiba Corporation for Verification and Yield Improvement of Advanced Flash Memory Designs</title>
<link>http://www.edn.com/pressRelease/2140484980.html?nid=3375</link>
<description>Advanced Electrical Behavior Analysis Capabilities Validated on 32-nm Designs</description>
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<title>EVE CEO Luc Burgun to Participate in IP-ESC'09 Panel on Transactors</title>
<link>http://www.edn.com/pressRelease/2140484993.html?nid=3375</link>
<description>EVE Exhibit to Highlight Benefits of ZeBu-Server Scalable Emulation System</description>
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<title>TI revolutionizes design of wireless networking applications with eZ430-Chronos, world&amp;#8217;s first customizable development environment in a sports watch</title>
<link>http://www.edn.com/pressRelease/2140485051.html?nid=3375</link>
<description>$49 CC430 MCU development kit propels innovation through portability, leading integration, software support and ultra-low power consumption</description>
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<title>Calypto Empowers Intrinsity to Deliver Industry&amp;#129;fs Fastest, Most Power-efficient Third-party Processor Cores</title>
<link>http://www.edn.com/pressRelease/2140485057.html?nid=3375</link>
<description>Comprehensive Verification Tool Enables Intrinsity to Aggressively Optimize Designs</description>
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<title>Aonix Adds VxWorks/Intel&amp;#174; Architecture Target Support to ObjectAda Product Line</title>
<link>http://www.edn.com/pressRelease/2140485119.html?nid=3375</link>
<description>Aonix has released ObjectAda Real-Time with support for VxWorks/Intel x86 architectures targets. This is the first Ada compiler from Aonix to support VxWorks on Intel and VxSim for x86 targets. ObjectAda fully supports development and debug via Wind River&amp;#8217;s Workbench Eclipse-based environment.</description>
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