EDN Magazine — 05.25.95 More pins and less space beget new IC packaging (figure)

FIGURE 2

Fig 2— In this view of Tessera's µBGA, the flex-circuit faces you, and the slightly larger test die is beneath it. At the flex-circuit's perimeter are almost-microscopic fingers that attach it to bonding pads around the die's periphery. Close to the flex-circuit's perimeter are nearly 200 tiny, gold-plated solder bumps in several rows.

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