EDN Magazine — 05.25.95 More pins and less space beget new IC packaging (figure)

FIGURE 3

Fig 3—Hitachi builds this 672-pin BGA package (a) around Tessera's µBGA technology. The pc board in the cross-section view (b) is part of the BGA package. This pc board makes a transition from the very fine-pitch solder bumps on the flex circuit adjacent to the die to larger bumps on the BGA's bottom surface.

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