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Out in Front: January 4, 1996


Small packaging gains acceptance

The Panda Project has completed electrical tests of its very-small-peripheral-array (VSPA) semiconductor package. The packages enable high-performance chips to be made smaller, cheaper, and faster, according to the company. Manufacturers can use the VSPAs in semiconductors for cellular and wireless applications because the packages carry "clean" electrical signals. The VSPA tested two to three times better electrical parameters than conventional packages in frequencies as high as 3.5 GHz. The company expects the VSPA to be available in prototypes and small quantities in the first quarter; production quantities should follow in the second quarter.
-- by Fran Granville

The Panda Project, Boca Raton, FL. (407) 994-2300



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