Out in Front: July 18, 1996
Power packages pack large dice in standard housing
The
Max220 package from SGS-Thomson has the same footprint and lead spacing as the
industry-standard TO-220 package but has a die-area capacity comparable to the
larger TP-247 package, which is almost twice that of the TO-220. You can replace
two paralleled TO-220 packages with one Max220, which also features simple clip
mounting. The company's STU8NA80 power MOSFET and other devices are available in
the new packages. The STU8NA80 in the Max220 costs $4 (1000).
—by Fran Granville
SGS-Thomson Microelectronics Inc, Lincoln, MA. (617) 259-0300, fax
(617) 259-0300.
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