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Motorola
designed its 16-pin PFP-16 power flat package for RF power amplifiers and
similar components. You can attach and solder this surface-mount package to the
pc board using the same standard reflow process you use for other components,
thus simplifying design and production. The semiconductor die mounts directly
onto an exposed, plated-copper slug that forms the bottom of the package, thus
providing both a low-impedance RF ground and thermal path for the device.
Integrated power amplifiers due this year for analog, GSM (Global Systems for
Mobile communications), and CDMA cellular phones will be the first products to
use the new package.—by Bill Schweber
Motorola Semiconductor Products, Phoenix, AZ. (602) 413-4730, RYCJ10@email.sps.mot.com.
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