FIGURE A
(a)NOTES: MINIMUM CHIP SPACING: ~150 MIL. HOLES TO SIGNAL LAYER. (left)
(b)NOTES: MINIMUM CHIP SPACING: ~30 MIL. MICROVIAS TO SIGNAL LAYER. (right)

Conventional vias lie outside the IC-lead-pad area (a); microvias let you put the via adjacent to the IC lead pad (b) (photo courtesy Merix Corp).

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