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June 18, 1998
Hot swap shrinks CompactPCI downtime
Warren Webb, Technical Editor
As CompactPCI's popularity grows, a new hot-swap specification boosts
system reliability for competition in the high-availability arena. Before your next--or
first--CompactPCI design, take a look at new techniques for live insertion and removal of
component boards in a functioning system.
Inserting or removing a pc board with power applied usually leads to disaster. Sparks,
smoke, or the silence of system shutdown signals your mistake. It may take several days of
frantic troubleshooting to find and replace the damaged components. That kind of mistake
might be history with a new hot-swap initiative that the PCI
Industrial Computer Manufacturers Group (PICMG)
just introduced for CompactPCI.
New hardware and software additions to CompactPCI not only tolerate
live-board insertion and removal, but also dramatically improve system downtime by
allowing hot swapping of a defective board while the remainder of the system continues to
function normally.
CompactPCI's developers based the standard on the Eurocard form factor.
A rugged superset of the desktop PCI bus, CompactPCI allows designers to take advantage of
off-the-shelf PCI silicon and desktop software (Reference 1).
This open architecture is an ideal platform for the growing telecomm and datacomm
industries. Recently, according to Joe Pavlat, director of strategic planning of Motorola Computer Group, major telecomm-equipment
suppliers, such as Lucent, Northern Telecom, and Mitel,
have come down with "outsourcing fever."
Says Pavlat, "They've made a complete 180º flip--from doing
everything internally to buying everything and concentrating on the core
competencies." Following Lucent's lead, most of
the telecomm-equipment suppliers have selected CompactPCI for new digital communications
systems. However, standard CompactPCI does not measure up to their vision of low-cost,
ultrareliable, easy-to-maintain communications hardware. To meet their system-availability
goals, the telecommunications companies need to replace defective boards without shutting
down the system. Hardware and software must dynamically route signals around defective
components while waiting for repairs. Telecomm systems have had hot-swap capability for
years, but the techniques are proprietary and cannot adapt to open architecture.
Therefore, the major equipment suppliers have pressed for a hot-swap update to the basic
CompactPCI specification.
Recognizing the industry's need for hot-swap capability, PICMG commissioned a working technical committee soon
after releasing the 1995 CompactPCI core specification. Although the first core
specification and the current revision mention hot swapping and contain some of the
necessary elements, a complete picture has been unavailable until now. The technical
committee completed work on the CompactPCI hot-swap specification (PICMG 2.1) in March and expects executive-committee
approval soon (see box "What is PICMG
anyway?").
However, the path to the new specification was not easy. The PCI Special Interest Group's (PCI SIG's) hot-plug initiative clouded PICMG's initial direction. PCI
SIG is responsible for the desktop-PCI specification and needed a technique for live
insertion and removal of boards for high-end servers. Compaq
Computer developed an active-backplane approach that could electrically connect and
disconnect any of the four or five PCI slots without disturbing the other slots. Users
could insert and remove standard off-the-shelf PCI boards without modification. With its
considerable influence, Compaq was able to get Microsoft, Novell,
and Santa Cruz Operation to include hot-plug software in
Windows NT, NetWare, and UnixWare, respectively. The hot-plug work looked like an ideal
starting point for the CompactPCI hot-swap technical committee. However, after six months
of debate and strong demands from the telecomm members, the committee elected to take a
different approach with a completely passive-backplane. The main reason was that, if any
of the components on an active backplane failed, the repair time would skyrocket. A
drawback of the passive-backplane approach is that the burden of extra hot-swap circuitry
falls on the adapter-board designer.
Three hot-swap levels
The new specification covers silicon, power-circuitry, backplane, and
software requirements for the basic, full, and high-availability hot-swap levels. The
levels range from manual to fully automated, depending on the software and PCI-interface
silicon you use.
Basic hot swap is a manual approach you initiate when you enter the
defective CompactPCI board number through the system console. The software then sends a
signal to the board to disable PCI-bus communications and notifies you when it is OK to
remove and replace the board. Basic hot swap works with PCI-bus-interface silicon and
Windows NT.
Full hot swap requires PCI-interface silicon with a built-in
control/status register that enables the operating software to automatically identify the
defective board. With full hot swap, you remove the defective board without console
interaction with the system software. As you open the card ejector, a switch on the board
sends an interrupt signal, ENUM#, to the CPU to denote that a hot-swap event is in
progress. The CPU then polls the PCI silicon to determine the exact board and follows with
board shutdown. The board front-panel LED illuminates to tell you that the board is safe
for removal. When you install the new board, the ejector switch generates another ENUM#
signal to notify the CPU to enable the board.
High-availability hot swap targets systems in which users demand an
absolute minimum of downtime. In addition to all the full-hot-swap capabilities,
high-availability systems have a hardware-connection controller that can disable a
malfunctioning board and replace it with a standby board already plugged into the system.
This level is currently only a vision, but the goal is to achieve fault-tolerant systems
and unattended repair.
A typical
full-hot-swap adapter card contains a PCI-interface chip, power circuitry, a precharge
network, a front-panel LED, and an ejector switch (Figure 1).
The power circuitry accepts early power from the longest staged pins on the backplane
connector in a controlled manner to prevent power-voltage sag. The power circuitry also
isolates the system-reset line from local reset. When you plug a hot-swap board into the
backplane, you need a local reset that is independent of the rest of the system. The
resistor network provides a 1V-dc precharge bias voltage to the PCI-bus signals before
contacting the backplane. PCI-silicon manufacturers plan to eventually include the
precharge circuitry within the PCI chip. The hot-swap PCI silicon is electrically
equivalent to a standard bus-interface chip with the addition of a control-and-status
register accessible by the host CPU. The PCI silicon also interfaces to an ejector switch
and a front-panel LED. The ejector switch warns the software of an imminent
board-extraction event, and the front-panel LED signals when it is OK to remove the board.
Staged connector pins
One of the essential technologies of hot swap is the physical connection
between the board and the backplane. Making a direct connection between the two components
would certainly disrupt the other boards on the bus, unless you carefully consider
power-supply inrush current and connection to the backplane PCI signals. CompactPCI uses
staged pins of three lengths to control the physical connection to the backplane. Card
guides ensure that board insertion is perpendicular to the backplane. The longest pins are
the first to mate and supply power and ground to precharge the PCI-bus signals to 1V dc.
Series resistance limits the power-supply current surge. The medium-length pins connect to
the PCI-bus signals that are in a precharged, high-impedance, or disabled state. The
shortest pins enable bus communications. Although the original CompactPCI standard
specified staged pins on the backplane connector, the developers had to make some changes
to implement the passive-backplane approach that the PICMG
technical committee selected. Older Compact-PCI backplane connectors do not work with the
new specification, and users must retrofit them with the new staged-pin connectors before
hot-swap operation. Amp and AVX already offer 2-mm modular connectors for hot swap.
Hot swap
also needs another important technology: PCI-bus-interface silicon. The manually initiated
basic hot swap works with PCI Version 2.1 silicon that can tolerate VCC from
early power, asynchronous release of reset, and the precharge voltage. However, for full
hot swap and high availability, the PCI silicon must include a control-and-status register
(Figure 2). The operating software uses the
status bits to determine which adapter board in the system is driving the ENUM# signal and
to distinguish between board insertion and removal. The control bits in the register clear
the ENUM# bit and control the front-panel hot-swap LED. PLX
Technology has announced two PCI-silicon devices that are compatible with CompactPCI
full hot swap. The $24 (100) PCI 9054 I/O accelerator targets CompactPCI bus-master
adapter cards. The $55 (100) IOP 480 includes a 66-MHz, 32-bit PowerPC 401 RISC CPU core
in addition to the PCI interface. Samples of both products will be available in the third
quarter of this year, and production quantities will be available in the last quarter. PLX
has also announced a full-hot-swap reference-design kit incorporating the PCI 9054 on a 6U
CompactPCI board.
The most
critical technology necessary for hot swap is the software. The operating system must
dynamically allocate and deallocate system re-sources, including memory address, I/O
address, and interrupt assignment, during a hot-swap event while the remainder of the
system functions normally. The hot-swap technical committee elected to use the PCI SIG's hot-plug-initiative software (Figure 3). Hot-plug software operates like basic
hot swap. You must request a board change through the system console and wait for the
software to deallocate system resources. The device driver for the board must be
hot-swap-aware. To support full hot swap and high availability, you must add a common
software driver to the operating system to automatically detect the ENUM# signal that
precedes a live insertion or removal. The driver then polls the CompactPCI boards in the
system to determine which board caused the event, communicates with operating software to
initiate the resource changes, and updates the board-status register to complete the
hot-swap event. PICMG has sponsored a development
effort to produce the CompactPCI common software driver for Windows NT 5. PICMG anticipates that Windows NT 5 will include the
required software, but, if not, it will be available free from PICMG or the CompactPCI-board vendors.
Real-time hot swap?
Real-time-operating-system vendors are starting to support hot swap for
CompactPCI. For example, Lynx Real-Time Systems Inc has
announced the $5995-per-seat Lynx/HA, an option to the
company's basic OS that supports high-availability functions. QNX
Software Systems also claims to support hot swap with its current microkernel OS.
In addition to the new ENUM# signal, hot swap imposes some capacitance
restrictions on the backplane to ensure that the connection and disconnection do not
disrupt the PCI signals. Most backplanes meet the capacitance requirements, but it is
worth checking if you plan to retrofit a system to meet the new hot-swap specifications. Bustronic and Amp
supply hot-swap-compatible backplanes.
One new requirement for the CPU board in a hot-swap environment is that
the CPU board must recognize the ENUM# signal to respond to hot-swap requests. This signal
appears on a backplane trace that earlier CompactPCI specifications did not use. Most CPU
manufacturers have been following the progress of the hot-swap committee and have updated
their CPU boards to include the ENUM# input signal. For the record, hot swap does not work with CPU boards. CPU failures require complete system shutdown
for replacement. CompactPCI CPU boards are available from a number of vendors, including Motorola Computer Group, Ziatech, Sun Microsystems,
Teknor Industrial Computers, Force Computers, Pep
Modular Computers, and OR Industrial Computers.
So, can you buy a hot-swap-compatible CompactPCI board today? Yes, a few
specialized boards are available for telecomm applications. Most of the boards that
require hot swap are proprietary communications adapter boards that telecomm-equipment
suppliers build for their customers and are unavailable on the open market. However, you
should consider designing hot-swap features into your Compact-PCI boards. The additional
board requirements are minimal if you choose the right PCI silicon. Hot-swap-compatible
boards will simplify system maintenance and may put you in the lead when your customer
demands that fault-tolerant, self-repairing, zero-downtime supersystem.
- Quinnell, Richard A, "CPCI passes potholes,
enters the on-ramp," EDN, Oct 23, 1997, pg 91.
Acknowledgments
Thanks to Joe Pavlat of Motorola
and PICMG; Mark Easley, Kelly Ambriz, and Rob Robinson
of PLX Technology; and Jim Medeiros of Ziatech for their valuable insight. |

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- A new hot-swap specification puts CompactPCI to work in the booming
telecommunications industry.
- Hot-swap-compatible PCI-bus-interface silicon is available for new
CompactPCI adapter-board designs.
- CompactPCI hot swap leverages the PCI SIG
hot-plug software for immediate operation with Windows NT, NetWare, and Unix-Ware.
- Hot swap paves the way for fault-tolerant, self-healing systems.
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| Four computer vendors formed the PCI Industrial Computer Manufacturers Group (PICMG) in 1994 as a consortium to standardize the use of
ISA- and PCI-bus products. The group immediately began work on CompactPCI. A technical
committee comprising six member companies produced the first CompactPCI specification in
November 1995. By mid-April 1998, PICMG had grown to
389 members with affiliate organizations in China, Japan, and Europe. PICMG's Web site lists more than 250 products available
for CompactPCI. In addition to the core CompactPCI specification, PICMG technical committees are working on 11 auxiliary
CompactPCI specifications including hot swap. The PICMG
specifications under development are: PICMG 2.1 CompactPCI hot swap defines pin sequencing,
hardware technologies, and the software architecture to support live insertion and
extraction of boards in a CompactPCI system.
PICMG 2.2 VME64x bus pin assignments
on CompactPCI defines pin assignments for the VME64 extensions, as standardized under the
auspices of ANSI and the VME International Trade Association (VITA) on J5/P4 and J5/P5 of
a CompactPCI backplane.
PICMG 2.3 PMC I/O pin assignments on
CompactPCI defines user I/O-pin mappings from IEEE 1386 PMC sites to J3/P3, J4/P4, and
J5/P5 on a CompactPCI backplane.
PICMG 2.4 IP I/O pin assignments on
CompactPCI defines user I/O-pin mappings from ANSI/VITA standard IP sites to J3/P3, J4/P4,
and J5/P5 on a CompactPCI backplane.
PICMG 2.5 CompactPCI computer-telephony defines
pin assignments for the computer-telephony functions of standard time-division-multiplexed
buses, telephony rear I/O, 48V dc, and ringing distribution in a 6U chassis.
PICMG 2.6 PCI-to-PCI bridging for
CompactPCI backplanes defines the bridging of two CompactPCI local buses in one slot in a
6U environment.
PICMG 2.7 dual CompactPCI backplanes
defines a means for CompactPCI CPU boards to drive two independent PCI-bus segments in a
6U environment.
PICMG 2.8 CompactPCI instrumentation
extensions defines the pin assignments (not the timing and synchronization features) for
the J2 connector for use in instrumentation systems based on CompactPCI.
PICMG 2.9 secondary system-management
bus for CompactPCI defines a secondary system-management bus to allow the host or other
subordinate processors to interrogate and control CompactPCI cards.
PICMG 2.10 keying of CompactPCI
boards and backplanes defines the keying mechanisms in IEC 1076-4-101 for the J4/P4
connector and in IEEE 1101.10 for handle and card-guide hardware.
PICMG 2.11 front-access power
connectors removes the current power-connector requirement from the base specification and
expands it to include new technologies. |
For more information...
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| When you contact any of the following vendors
or organizations directly, please let them know you read about their products on EDN's web
site. |
Amp
Harrisburg, PA
1-717-592-2409
www.amp.com |
Mitel Corp
Kanata, ON, Canada
1-613-592-2122
fax 1-613-592-4784
www.mitel.com |
Pep Modular Computers
Pittsburgh, PA
1-412-921-3322
fax 1-412-921-3356
www.pep.de |
AVX
Marlborough, MA
1-508-485-8114
fax 1-508-485-8471
www.avxcorp.com |
Motorola Computer Group
Tempe, AZ
1-602-438-3287
fax 1-602-438-3518
www.mot.com/computer |
PLX Technology
Sunnyvale, CA
1-408-774-9060
fax 1-408-774-2169
www.plxtech.com |
Bustronic
Fremont, CA
1-510-490-7388
www.bustronic.com |
Natural MicroSystems
Framingham, MA
1-508-271-1243
www.nmss.com |
QNX Software Systems
Kanata, ON, Canada
1-613-591-0931
fax 1-613-591-3579
www.qnx.com |
Compaq Computer
Houston, TX
1-281-370-0670
fax 1-281-514-1740
www.compaq.com |
Northern Telecom
Brampton, ON, Canada
1-905-863-0000
www.nortel.com |
Santa Cruz Operation
Santa Cruz, CA
1-408-425-7222
fax 1-408-458-4227
www.sco.com |
Force Computers
San Jose, CA
1-408-369-6000
fax 1-408-371-3992
www.forcecomputers.com |
Novell
Provo, UT
1-801-861-7000
www.novell.com |
Sun
Microsystems
Palo Alto, CA
1-408-544-0288
www.sun.com |
Lucent Technologies
Murray Hill, NJ
1-888-584-6366
www.lucent.com |
OR Industrial Computers
Fairfax, VA
1-703-359-8988
fax 1-703-359-3895
www.or-computers.com |
Teknor Industrial
Computers
Boca Raton, FL
1-561-883-6191
fax 1-561-883-6690
www.teknor.com |
Lynx Real-Time Systems
San Jose, CA
1-408-879-3900
fax 1-408-879-3920
www.lynx.com |
PCI Industrial Computer
Manufacturers Group (PICMG)
Wakefield, MA
1-781-246-9318
fax 1-781-224-1239
www.picmg.com |
Ziatech
San Luis Obispo, CA
1-805-541-0488
fax 1-805-541-5088
www.ziatech.com |
Microsoft
Redmond, WA
1-425-882-8080
www.microsoft.com |
PCI Special Interest Group (PCI SIG)
Hillsboro, OR
fax 1-503-693-8344
www.pcisig.com |
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