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July 16, 1998
WHAT'S HOT IN THE DESIGN COMMUNITY
The IEEE 1394 Firewire bus may be the wave of the future, but the IEEE 488
general-purpose instrumentation bus isn't going away any time soon. However, the trend
toward "sealed" PCs makes it harder to use IEEE 488 interface cards that reside
within the PC. That's where bridge products come in. These units connect to external ports
on the PC and enable communication with instruments' via buses, such as the ubiquitous
IEEE 488. Such bridge products must provide software transparency, which allows test
programs to control instruments as if the instrument were connected to an ISA- or
PCI-bus-based IEEE 488 interface.
National Instruments, which offers Universal Serial Bus (USB)- and Ethernet-to-IEEE 488
bridge units, is now introducing a unit that uses the IEEE 1394 Firewire serial bus to
perform a similar function. Firewire offers a 400-Mbps maximum burst-transfer rate. That
speed is 50 times as great as that of IEEE 488 itself and almost 100 times as fast as any
device can communicate via USB. The $695 GPIB-1394 receives power from the Firewire bus
and can communicate over the bus at 400, 200, or 100 Mbps. The unit implements the full
range of normal and extended IEEE 488 talker and listener functions, including serial and
parallel polling, service requests, and pass/receive control functions.
--by Dan Strassberg
National Instruments, Austin, TX. 1-800-258-7022, fax 1-512-683-8411, info@natinst.com, www.natinst.com.
Filtering to eliminate undesired inband or out-of-band noise is a standard design
requirement, and the MSU1HFx family of switched-capacitor IC filters from Mixed Signal
Integration can simplify your task. You configure these universal filter ICs using
resistors for lowpass, highpass, elliptic, bandpass, notch, or allpass modes using
external resistors. The resulting design requires zero to nine resistors, depending on
filter type and response. You can set corner or center frequencies as high as 500 kHz,
select nominal clock-to-corner frequency ratios of 6.25-to-1 or 12.5-to-1, and obtain
attenuations as high as 40 dB.
Two of the eight-pin devices save power by operating at frequencies as high as 100 kHz,
typically requiring 5 mA from a 5V supply; the 500-kHz versions draw 20 mA. You can also
choose a 16-pin version that contains two filter sections, or you can cascade the
single-section filter ICs for higher order functions. Prices begin at $3.75 (1000).
--by Bill Schweber
Mixed Signal Integration, San Jose, CA. 1-408-434-6305, fax 1-408-434-6417, www.mix-sig.com.
Because of their reverse-isolation potential, cascode-transistor amplifiers work well
as RF functional blocks, such as VCOs, buffers, low-noise amplifiers, and mixers. Two
related cascode devices from Motorola for 100-MHz to 2.5-GHz operation save board space by
integrating all requisite bias circuitry and by using a four-pin SOT-143 surface-mount
package. The MRFIC-0916 provides 18.5-dB typical and 20.5-dB maximum gain at 850 MHz with
a 2.7V supply, although it can operate from a 5V supply. It also offers 44-dB reverse
isolation at that frequency. Maximum bias current is 5.6 mA; the on-chip bias circuitry
yields better temperature stability than you could achieve with external bias circuitry.
Output power for this IC is 2.3 dBm at 1-dB gain compression, also at 850 MHz; for maximum
application flexibility, you provide the matching circuitry outside the IC.
The similar MRFIC0915 operates at 2.5-mA maximum bias current, thus saving power, but
consequently has reduced isolation performance of 38 dB. The devices' data sheets list
scattering parameters for each 100-MHz point in their operating range, easing modeling and
design. The MRFIC0915 and 0916 cost $0.75 and $0.90, respectively (10,000).
--by Bill Schweber
Motorola Semiconductor Products Sector, Phoenix, AZ. 602-413-4991; fax: 1-602-413-7986,
www.motorola.com/wireless-semi.
Texas Instruments' new ThunderSwitch II for Giga and Fast Ethernet and ThunderSwitch I
for 10-Mbps desktop switches support IEEE standards for full- or half-duplex operation on
all ports, virtual-LAN interoperability, and packet priority levels. The products also
provide link aggregation, or "trunking," to combine multiple ports into one
logical channel. The switch chips collect Etherstat (Ethernet Statistics, a subset of
simple-network-management-protocol management-interface bases) and remote-monitoring
statistics on a per-port basis to reduce the work of the switch-management CPU.
The first chip in the ThunderSwitch II family, the TNETX4090, offers eight 10/100-Mbps
ports and one 100-Mbps/1-Gbps uplink port. This device uses Rambus DRAM (RDRAM) to get
4-Gbps memory bandwidth from a memory chip. In addition, you can use the Giga Ethernet
uplink port to cascade as many as four TNETX4090s to design a 32-port Fast Ethernet
switch. Alternatively, for switches with more ports, you can use a
"port-awareness" mode on the device and an additional stand-alone crossbar
switching device. Samples of the TNETX4090 are available in 352-bump BGA packages and cost
$90 (10,000).
The ThunderSwitch I family incorporates four pin-compatible devices. Using the same
package for all four devices provides a pc-board design that supports four port densities.
The devices use a core that operates at 2.5V. All four devices have three 10/100-Mbps
uplink ports. The $95 (10,000) TNETX3270 offers 24 10-Mbps ports, the $85 TNETX3190 has 16
10-Mbps ports, the $76 TNETX3151 has 12 10-Mbps ports, and the $55 TNETX3110 has eight
10-Mbps ports.
--by Steven Kempainen
Texas Instruments, Dallas, TX. 1-800-477-8924, ext 4500, www.ti.com/sc/.
Digital-subscriber-loop (DSL) technology spawned chip and reference-design
announcements from Rockwell and Broadcom at the recent Supercomm show in Atlanta. Rockwell
Semiconductor introduced chip sets for both asymmetrical-DSL (ADSL) remote modems and
central-office applications. Meanwhile, Broadcom promoted a reference design for very
high-speed DSL (VDSL) that incorporates the BCM6010 DSL transceiver chip.
Rockwell's entry into the ADSL market offers chips for both ends of twisted-pair
telephone cabling. Both the remote modem and the central-office chip sets use the Falcon
discrete-multitone (DMT) transceiver technology from a joint development with Pairgain
Technologies (www. pairgain.com), a DSL modem
company. The V.90/ADSL Combo chip set for remote-access modems employs a multitasking
architecture for concurrent legacy analog and ADSL-modem operations. The three-chip set
dissipates less than 2W and provides functions for either the 56-kbps V.90 analog-modem
standard or the full-rate, 8-Mbps ANSI T1.413 Issue 2 ADSL standard. You can program the
chip set for upgrades to support the International Telecommunication Union's emerging
G.lite standard for the 1.50-Mbps-bit-rate, low-cost consumer version of ADSL that aims to
eliminate splitters at remote sites. The Combo chip set's sampling will coincide with the
expected finalization of the G.lite standard in the fourth quarter of this year. The chip
set costs $67.50 (10,000).
The central-office ADSL modem chip set from Rockwell supports eight ports, useful for
adding native ADSL to central-office switches and remote digital-loop carriers. The chip
set limits dissipation to 1.9 and 2.7W per channel, respectively, for G.lite and full-rate
modes. The chip set uses a low-power RISC controller to manage eight ADSL line
transceivers and a single-chip asynchronous-transfer-mode (ATM) Utopia Level II
physical-layer device. Samples of the Octal G.lite/ADSL device set will be available in
the fourth quarter and will cost $67.50 (10,000) per port.
Attacking the VDSL market, Broadcom introduced the BCM96011 reference design for a
modem that operates at 25.92 Mbps when using twisted-pair telephone cable as long as 3500
ft. You can configure the modem to support either remote- or central-office applications.
The reference design for Broadcom's BCM6010 VDSL transceiver chip consumes less than 2W
and operates at -40 to +808C.
The BCM6010 VDSL transceiver chip provides quadrature-amplitude-modulation (QAM)
variable-rate modulation and demodulation, ATM-cell formatting, Reed-Solomon forward error
correction, a convolutional interleaver, an on-chip ADC, and an on-chip DAC. Both the
reference design and the chip are available today. The BCM6010 chip costs $24.50
(100,000).
--by Steven Kempainen
Rockwell Semiconductor, Newport Beach, CA. 1-800-854-8099, 1-949-221-6996, www.rss.rockwell.com.
Broadcom, Irvine, CA. 1-714-450-8700, fax 1-714-450-8710, www.broadcom.com.
The Pocket Coolers family of fan heat sinks from Aavid Thermal Technologies provides
1.58C/W heat removal for Socket 7 CPUs and high-power BGA devices. The 7- to 15-mm-high
heat sinks use ball-bearing fans with a minimum lifetime of 50,000 hours at 258C. The
clip-mounted Model 3680 targets Socket-7 CPUs and other ICs (the i960, for example). Model
3681, designed for large BGAs, uses brass pushpins that offer high immunity to shock and
vibration. The 3682 is a low-profile blower with an aluminum base, designed to cool
various embedded mPs that cannot use traditional cooling. Prices are $9.92, $13.75, and
$9.23 (1000), respectively. You can order the cooling devices with or without a preapplied
interface material.
--by Bill Travis
Aavid Thermal Technologies, Laconia, NH. 1-603-224-9988, fax 1-603-223-1738, www.aavid.com.
The four-year-old, 32-bit, fixed/floating-point 2106x SHARC DSP architecture from
Analog Devices has served well in many high-performance DSP applications, especially those
requiring multiprocessing. But the DSP industry has recently witnessed significant
performance leaps, mainly because DSP suppliers have doubled their cores' execution units.
For example, Lucent's (www.lucent.com) DSP 16000
includes two multiply-accumulate (MAC) units, and Texas Instruments' (www.ti.com) C6x contains two nearly identical sets of
execution units. Similarly, Analog Devices' new single-instruction-multiple-data (SIMD)
SHARC builds on the 2106x and adds a second set of computation units, including an ALU, a
data register file, a barrel shifter, and a multiplier. Analog Devices' designers also
doubled the buses to allow the core to transfer four 32-bit operands per cycle.
The SIMD SHARC contains a programmable-mode bit that allows you to turn on or off the
second set of computation units and execute your legacy SHARC code. When you switch on the
second set, the core can still execute SHARC code but simultaneously processes two sets of
data. This approach may require you to modify your code by changing the loop count or
reordering data in memory.
Although the 2106x and SIMD SHARC have the same cache size and structure, the new
architecture can address as much as 8 Mbits of on-chip SRAM, double that of the 2106x.
Additionally, the company claims that the SIMD SHARC can operate at frequencies as high as
200 MHz, compared with the 2106x with a 40-MHz maximum operating frequency. Furthermore,
at 200 MHz, the SIMD SHARC can perform an FFT as much as 10 times faster than the 2106x.
The first device in this new family, the ADSP-21160, targets multiprocessing
applications. It operates at 100 MHz with a 2.5V core and 3.3V I/O. In addition to the
standard SHARC features, the 21160 contains 4 Mbits of on-chip SRAM; 14 channels of DMA;
two time-division-multiplexed serial ports; and a 66-MHz, 64-bit external bus. It supports
cluster multiprocessing with six 8-bit-wide, 100-MHz link ports. Analog Devices expects to
ship samples in the fourth quarter for $300.
--by Markus Levy
Analog Devices, 1-800-262-5643, www.analog.com.
The Tempest tool suite from Sycon includes Tempest-Cell for physical-library-cell
generation and Tempest-Block for assembling digital-logic blocks. Sycon targets both tools
at high-performance, cell-based chip designs. You use Tempest-Cell to generate static-CMOS
(no domino-logic circuits) library cells based on a Spice netlist, target-process
technology data, and any layout-constraint information. The tool outputs a physical
representation of the cell in common intermediate format (CIF), GDSII format, or
library-exchange format. Sycon provides cells with as many as 500 transistors and says
that Tempest-Cell can in only a few seconds generate a cell containing a few dozen
transistors. The tool currently has a text interface, but Sycon expects to offer a
graphical user interface by year-end. Although you use Tempest-Cell to rapidly populate a
cell library, you still have to validate each cell's per-formance and generate appropriate
models be-fore using the cells in a design.
With Tempest-Cell-generated or your own library cells, Tempest-Block creates complex
digital blocks or cores for your chip. Along with physical-cell data, Tempest-Block also
works with a structural Verilog netlist. You use the current version of the tool for
control logic and datapath blocks; Sycon is working on a version for memory blocks.
Tempest-Block uses Sycon's route-place-route (RoPRo) technology, which first routes all
the cells in the core, accounting for expected interconnect-parasitic delays. The tool
then places the cells in the core and follows the placement with an additional touch-up
routing operation. By using this sequence of layout operations, Tempest-Block lets you
design for critical parameters, such as zero-skew clocking or equal-load bus wires.
Tempest-Block uses physically based design constraints, such as equal wire lengths for
skew control, minimum wire length, and metal widths. Sycon is working on electrically
based constraints, including signal-integrity and power design parameters, for a future
version of the tool. Tempest-Block output is in CIF and data-exchange format and includes
interfaces to Cadence (www.cadence.com) floorplanning
and place-and-route tools.
Both Tempest tools run on Unix and Windows platforms. Prices start at $200,000 for
Tempest-Block and $250,000 for Tempest-Cell.
--by Jim Lipman
Sycon Design, Saratoga, CA. 1-408-868-0610, fax 1-408-868-0619, www.sycon-design.com.
With its CDMA+ Processor 100 chip, VLSI Technology emerges as the only company so far
to compete with Qualcomm (www.qualcomm.com) in the
market for baseband processors for IS-95 code-division multiple-access (CDMA) mobile
phones. The chip integrates an ARM (www.arm.com)
processor, an Oak+ (www.dspg.com) DSP core, peripherals,
an audio codec, a CDMA/advanced mobile-phone-service (AMPS) modem, and voice coders. The
chip reuses many of the system blocks that VLSI employs in its third-generation OneC
baseband processor.
The CDMA+ software package in-cludes the CDMA and AMPS protocol stack to help designers
get their phones working and certified, along with VLSI's JumpStart multicore development
tool for integrating ARM and Oak+ software. A CDMA+ development board and debugging tools
are also available. Samples are now available, and price will be less than $20 in volume
quantities.
--by Steven Kempainen
VLSI Technology, San Jose, CA. 1-408-434-3000, www.vlsi.com.
Hewlett-Packard has just introduced the latest additions to its Kayak workstation
family, which HP based on Intel processors and the Windows NT operating system. The New
Kayak XU and XW models are the first in the family to take advantage of the Slot 2 system
bus. Slot 2 offers numerous enhancements over Slot 1, which debuted with the original
Pentium II ICs. Whereas Slot 1 used cache operating at a much lower speed than the mP to
lower cost, the Slot 2 processors feature full-speed cache and high performance. Moreover,
Slot 2 supports larger main-memory arrays. Both of the new HP systems can support as much
as 2 Gbytes of synchronous DRAM.
HP ships the systems with standard dual 10,000-rpm disk drives, a dual-channel SCSI
controller, and a RAID (redundant-array-of-inexpensive disks) controller. Both can include
one or two Pentium II Xeon processors operating as fast as 400 MHz, and both include the
AGP (accelerated graphics port). Electronics designers will likely find the lower cost XU
suitable for EDA tasks. Prices for the system start at $5000, including 3D Labs' (www.3dlabs.com) Permedia 3-D graphics capabilities, which
are on the high end of the PC market but more entry level for the workstation market.
Prices for the XW start at $12,000, including HP Visualize, a high-end 3-D-graphics
subsystem that HP based on six HP PA-RISC mPs and that can host 50 Mbytes of video memory.
--by Maury Wright
Hewlett-Packard Co, Santa Clara, CA. 1-408-246-4300, www.hp.com.
G-Link's first sensor product, the high-dynamic-range CMOS (HDRC) image-sensor family,
delivers high dynamic range, high sensitivity, and high speed that overcome extreme
lighting conditions. (The Institute for Microelectronics Stuttgart (www.uni-stuttgart.de/ims/) developed the HDRC
image-sensor technology.) Extreme lighting conditions cause image sensors to saturate in
bright-light conditions and lose clarity in low-light conditions. HDRC employs a constant
contrast resolution in increments of 1% over four decades of intensity to resolve images
in poor lighting, making the product useful in security, traffic control, and factory
automation.
The 5123256-pixel HDRC 4 image sensor has a constant pixel rate that simplifies data
synchronization and all DSP and compression functions. The device supports 120-dB dynamic
range, 120 frames/sec, and random access to a pixel or region of pixels. The device uses a
48-pin ceramic SDIP and a single 3.3V supply. Samples are now available for $40 to $50 in
volume quantities.
--by Steven Kempainen
G-Link, Santa Clara, CA. 1-408-492-9068, www.glinktech.com.
Nobody's been hurt, but somebody could be, and Tektronix (Beaverton, OR) wants to
ensure that that doesn't happen. The company is therefore voluntarily recalling
approximately 60,000 TDS 210 and TDS 220 digital oscilloscopes. Although they may appear
to behave completely normally, scopes that have been damaged through misuse can present a
safety hazard. A trace on a pc board inside the scope normally establishes a ground
connection, but the connection can open if you accidentally apply a high voltage to a
probe's ground lead. You can receive a dangerous shock if you touch certain points on a
scope with a failed ground connection.
The TDS 210 and 220 are 55/83 12341/4-in. (approximately), ac-powered benchtop units
with black-on-white LCDs. Tek has recalled TDS 210 units with serial numbers below BO49400
or CO10880 and TDS 220 units with serial numbers below BO41060 or CO11175. To receive
instructions for returning recalled units, call Tektronix at 1-800-835-9433, ext 2400 or
visit the company's Web site at www.tek.com/measurement.
--by Dan Strassberg
Claimed the industry's smallest ceramic chip resonator, the SSR family of surface-mount
devices from AVX measures 3.232.131.5 mm. The resonators incorporate load capacitors and
are available with an operating frequency of 16 to 60 MHz (±0.5% accuracy). Several
standard frequencies are available. Maximum resonant impedance is 100V with temperature
stability of ±0.3% over operating temperatures of -20 to +808C. Typical price is $0.30
(100,000).
--by Bill Travis
AVX Corp, Myrtle Beach, SC. 1-803-946-0414, fax 1-803-448-1943, www.avxcorp.com.
Remaining at a $99 bargain-basement price, Cypress' Warp2 programmable-logic-design
tool adds three capabilities: You can now input Verilog descriptions, complementing the
tool's VHDL capability. A Warp tool supports either HDL. And, with technology Cypress
obtained from Aldec (www.aldec.com), Warp2 now provides
finite-state-machine (FSM) editing and a timing simulator.
Cypress has developed a synthesis tool for Warp2 that uses automatic module generation
that finds recognizable circuits, such as arithmetic and datapath operators, in your code
and replaces them with functionally equivalent circuits optimized for the target device.
Along with either VHDL or Verilog synthesis, Warp also has a context-sensitive,
color-coded HDL editor to help you input your HDL-based design.
The FSM editor lets you graphically describe state machines and generate HDL code from
the descriptions. You use the timing simulator on a structural VHDL netlist for delay
information. Warp runs on Unix and Windows platforms; you can use the tool with all
Cypress programmable-logic devices.
--by Jim Lipman
Cypress Semiconductor, San Jose, CA. 1-408-94-2600, www.cypress.com.
Vicor's second-generation family of high-power-density dc/dc converters have power
densities of 80 to 120W/in.3. The 375V-input converters are compatible with
power-factor-correcting (PFC) front-end modules. Packages measure 4.632.230.5 in.
(117356312.7 mm); the packaging provides a stepped profile that allows you to recess the
modules into a board cutout for a total aboveboard height of 0.43 in. Cutout mounting also
exposes the underside of the converter to airflow for effective heat removal. The modules
can accommodate base-plate operating temperatures as high as 1008C. The 400W V375A5C400A
provides a 5V, 80A output at 84% efficiency. The 600W converters are available with
outputs of 48V (V375A48C600A; 90% efficiency), 28V (V375A28C600A; 89% efficiency), or 24V
(V375A24C600A, 87.7% efficiency). Single-quantity prices are $180, $248, $243, and $243,
respectively.
--by Bill Travis
Vicor Corp, Andover, MA. 1-978-470-2900, fax 1-978-475-6715, www.vicr.com.
Calendar
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Aug 16 to 18
Hot Chips 10, Palo Alto, CA, is a
symposium that focuses on high-performance chips, systems, and related topics. Topics
include RISC, CISC, and VLIW processors; 3-D graphics and multimedia chips; embedded CPUs,
chip sets, and DSP chips; special-function chips; low-power chips and technologies;
intelligent and high-performance memory chips; field-programmable and reconfigurable
chips; compilers and binary translators; benchmarking and performance evaluations; and new
technologies.
Hot Chips, Los Gatos, CA. Fax 1-408-867-5831, www.hotchips.org.
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