EDN’s 20th annual Innovation Awards Finalists
-- EDN, February 18, 2010
|
&& PREVIOUS FINALIST | MAIN | NEXT FINALIST >> Category: RFICs Finalist: FM2491_FC flip-chip-based RF front-end IC, Epic Communications  The Epic Communications FM2491_FC is a RF Front-End Integrated Circuit (FEIC) for smart-phone and mobile Internet device WiFi applications. It uses a BiFET (bipolar and field effect transistor) wafer foundry process, which integrates InGaP (Indium gallium phosphide) bipolar HBT (heterojunction bipolar transistors), and GaAs (Gallium arsenide) pHEMT (pseudomorphic high electron mobility transistor) processes into one die. The part is offered as a flip-chip with no wirebonds, instead it uses copper-pillar solder bumps. The FM2491_FC integrates a 2.4-GHz power amplifier (PA) with >19-dBm output power, a low-loss, linear SP3T (single-pole triple-throw) switch, a high pass filter (HPF), an on-board power detector, advanced temperature compensation circuitry, CMOS (1.6V-2.1V) compatible control logic, and all input/output matching and biasing circuitry. The part operates over -25°C to +85°C with a power supply range from 2.7 to 4.8V. Current consumption is less than 120 mA at 3.3V with linear output power of 18dBm. |
|
Talkback
