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EDN’s 20th annual Innovation Awards Finalists

-- EDN, February 18, 2010



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Category: Embedded-system Technologies
Finalist: StackableUSB carrier/hub board bridges, Micro/sys




The Micro/sys family of stackable carrier and hub boards enables OEMs to convert their existing USB ports to the well-defined embeddable USB standard: StackableUSB. This line of products provides a bridge permitting users to select off-the-shelf single board computers from various manufacturers and retain the advantages of the StackableUSB I/O devices. The Micro/sys StackableUSB carrier/hub boards provide an electrical and mechanical platform for the embedded industrial user to convert to uniform I/O devices implementing USB, SPI, and I2C no matter what footprint or communication output the CPU employs.

Electrically, the Micro/sys line of carrier/hub boards bridges to multiple USB outputs on CPU boards including StackableUSB, SUMIT, COM Express, and the traditional Type A or Mini-B USB connectors. The carrier/hub boards route the USB ports from these off-the-shelf CPUs into multiple StackableUSB bays, which offer a clear, easy-to-understand USB, SPI, and I2C protocol for I/O expansion.

This family of products acts as a bridge between the various mechanical footprints, such as Pico-ITX, Nano-ITX, 104 Form Factor, EPIC, COM Express, and the recently introduced Freescale Tower. The carrier/hub boards secure tightly to the CPU with standoffs to form a rugged brick ensuring the integrity of the system. Each carrier/hub board then accommodates a combination of full-size, ½-size, and ¼-size 104 form factors stacking up or down to provide OEMs easy access to USB I/O expansion.

EDN INNOVATION AWARDS





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