Atotech joins Sematech’s 3D interconnect program
Sematech's 3D interconnect program gains Atotech copper electroplating of TSVs to the consortium's pool of expertise.
By Gail Flower, Contributing Editor -- EDN, April 16, 2009
Berlin-based Atotech has joined Sematech's 3D interconnect program at CNSE (College of Nanoscale Science and Engineering) at the University at Albany, NY.
Atotech’s expertise in metallization will be applied in research on the development of high-yield, low-cost copper electroplating for void-free filling of high density 3D TSVs (through silicon vias), according to Sematech, a global consortium of chipmakers.
TSVs are hollow, short interconnections between chip layers that replace wire bonds. Forming and filling TSVs without voids and keeping the conductivity flowing has been a difficult roadblock for 3D interconnect technology.
Back in January, Atotech announced that it would conduct R&D in copper plating as a partner with CNSE. At that time, the agreement between Atotech and Albany NanoTech include chemistry development and analytical techniques used for chipmaking, chemical and biological sensors and biochips for medical applications. The initial agreement included potential for further initiatives, such as this new partnership with Sematech to develop low-cost electroplating for 3D TSVs.
“We are excited to be part of the Sematech 3D interconnect program, working with the most advanced 300-mm equipment and technologists in developing this leading-edge technology,” said Robert Preisser, VP of semiconductor technology at Atotech, in a statement. “By building on its presence at CNSE’s world-class Albany NanoTech, Atotech is positioned to make significant contributions to the development production of 3D devices, aiding their rapid adoption in to mainstream electronics.”
Other consortia are also involved in the race to speed 3D stacked chips to market. EMC-3D, for example, has membership aimed at producing 3D TSV interconnects at less than $150 per wafer. Major players, such as Applied Materials with its critical process and integration expertise in etching, are part of the EMC-3D.
IMEC, a leading independent research center in nanoelectronics, partners with industry and universities to help deliver products from the laboratory and into industrial applications, and its program partners for 3D integration and include IDMs, semiconductor packaging companies, EDA houses, and equipment and material suppliers.
Sematech’s 3D IC program launched two years ago. In 2008, in collaboration with the UAlbany NanoCollege, the program addressed infrastructure and development challenges, including materials characterization, unit process and integration, equipment hardening, reliability, and cost and benefit to device and circuit performance.
