Hynix joins with IMEC for sub-32-nm R&D
By Colleen Taylor, Contributing Editor -- EDN, May 24, 2007
South Korea-based memory chip maker Hynix Semiconductor Inc. has entered into a strategic partnership with Belgium-based nanoelectronics research center IMEC to perform research and development for the 32-nm and below memory process generations.
As part of the agreement, Hynix said it will collaborate within IMEC's advanced lithography program addressing both immersion and EUV lithography challenges and within IMEC's non-volatile memory program. From June 2007 onward, a team of researchers of Hynix will reside at IMEC to closely collaborate with IMEC's researchers in their research and development.
With this agreement, IMEC said, the top five leading memory suppliers including Hynix, Elpida Memory Inc., Micron Technology Inc., Qimonda AG and Samsung Electronics Co. Ltd., collaborate within its global research platform to scale CMOS to 32-nm node and beyond.
For Hynix, the partnership brings safety in numbers for venturing to ever-smaller process technologies.
"With facing various challenges in developing next-generation technologies, difficulty and risk have continually increased," said Park Sung-Wook, executive VP and head of Hynix's R&D division, said in a statement. "By joining IMEC and collaborating with industry-leading partners, we expect to lessen the risk for developing leading-edge, cost-effective technology and contribute to the growth of the semiconductor industry."
