Intel, SiRF sign development deal for next-gen mobile connectivity
By Colleen Taylor, Contributing Editor -- EDN, July 31, 2007
As part of its steady pursuit of enabling wireless connectivity far and wide, leading chipmaker Intel Corp. has signed a license and joint development agreement with SiRF Technology Inc. on future product platforms the companies said could help location and wireless connectivity become more mainstream in next-generation mobile devices.
As part of this agreement, SiRF has licensed certain technologies to Intel and will help co-develop certain future products that will be available for incorporation into Intel mobile platforms. The companies have agreed to jointly market and sell these products globally for use in a wide range of devices, such as mobile internet devices, mobile phones and handheld consumer devices.
Financial terms of the deal have not been disclosed.
"SiRF has a vision to bring the benefits of location enabled content and applications to the mainstream mobile consumer and enterprise markets," Kanwar Chadha, founder and VP of marketing for SiRF, said in a statement. "We look forward to working with Intel to develop innovative new products to realize the promise of location and wireless connectivity in future mobile devices."
"Our collaboration with SiRF will enable us to bring highly integrated solutions combining industry leading WiMax/WiFi connectivity and location capability to mobile internet device and notebook customers worldwide," Raviv Melamed, general manager of Intel's mobile wireless group, said in a statement.
In December, Intel debuted its first mobile WiMax baseband chip it said was part of its efforts to deliver an "always best connected" mobile Internet experience for future laptops and mobile devices. Last month, the company gathered with other key industry players to push interoperability among Mobile WiMax products at the third public Mobile WiMax PlugFest in Sophia Antipolis, France.
