Qimonda, Winbond extend DRAM foundry deal
By Colleen Taylor, Contributing Editor -- EDN, June 27, 2007
Munich, Germany-based memory maker Qimonda AG and Taiwan-based IC solutions provider Winbond Electronics Corp. today announced that they have signed an agreement to further expand their existing cooperation for the production of DRAM memory chips.
Under the terms of this agreement, Qimonda will transfer its 75-nm and 58-nm DRAM trench technology to Winbond's 300-mm facility in Taichung, Taiwan. In return, Winbond will manufacture DRAMs for computing applications in these technologies exclusively for Qimonda. The transfer of the 58-nm-technology from Qimonda will also allow Winbond to develop and sell respective proprietary specialty memories for which Qimonda will receive license fees and royalties.
This new agreement is the extension of the two companies' long-existing cooperation. In May 2002 and August 2004, Winbond and Qimonda (then the memory unit of Infineon) signed agreements on the transfer and licensing of the 110-nm and 90-nm DRAM-technologies for Winbond's 200-mm plant in Hsinchu and 300-mm plant in Taichung; in August 2006, Qimonda transferred its 80-nm DRAM trench technology to Winbond's 300-mm facility in Taichung.
"The successful cooperation in respect of the 110-nm, 90-nm and 80-nm process technology transfers encouraged us to further expand our foundry and license agreement with Winbond," Thomas Seifert, COO of Qimonda, said in a statement. "The expansion of the cooperation aims to further strengthen our production capabilities and flexibility."
