Amkor Joins Common Platform Effort
By Colleen Taylor -- EDN, September 25, 2006
Amkor Technology Inc. is teaming up with IBM, Chartered Semiconductor Manufacturing and Samsung Electronics Co. Ltd. in qualifying 90nm and 65nm flip-chip packaging and design capabilities for Common Platform technology.
Common Platform technology is a collaborative effort by IBM, Chartered, and Samsung to create an open and flexible design and manufacturing environment at leading-edge semiconductor technologies down to 45nm and beyond.
Amkor has already qualified several die and package combinations at both 90nm and 65nm with several new 65nm qualifications in process for the Common Platform partners. Additionally, the company has started 45nm qualifications for next-generation semiconductor applications, Amkor said.
"Extending the Common Platform technology ecosystem to include collaboration on advanced wafer bump and flip chip processes is a natural step in our evolution to provide clients complete solutions," Kevin Meyer, VP of worldwide marketing and platform alliances at Chartered, said in a statement.
"We are proud to welcome Amkor as a member of the Common Platform ecosystem, noting that in having already qualified the 65nm process for wafer bump and flip chip assembly, Amkor can provide market-ready solutions for customers," Ana Hunter, VP of technology for Samsung Semiconductor, said in a statement.
Synopsys has recently gotten into the Common Platform game as well. In July, the company announced that its extended RTL-to-GDSII low-power reference design flow would be available for the latest 65nm process offered by the Common Platform technology initiative.
