ISMI Exploring 450mm Manufacturing Transition
Online staff -- EDN, January 30, 2006
Austin, Texas-based International Sematech Manufacturing Initiative (ISMI) said today it has begun a program to explore critical issues and barriers to introducing a new wafer size for manufacturing in the semiconductor industry.
The new program is set to examine an incremental approach aimed at improving 300mm production in ways that could ease an eventual transition to larger wafers, the consortium explained.
The approach to be used, called 300mm Prime will include studies on how to improve equipment, automation, and factory integration to meet the challenges of high product mix, fast cycle time, and flexibility.
“Looking ahead at productivity assumptions, we realize that we must be very aggressive in pushing for improvements in manufacturing productivity,” noted Scott Kramer, ISMI director in a statement. “Part of the productivity formula includes serious preparation for larger wafer sizes.”
The purpose of the project is to pave the way for such a change. “We want to help make the wafer-size transition as efficient and cost-effective as possible, by involving a wide range of industry players-especially the equipment supplier community,” Kramer said.
The International Technology Roadmap for Semiconductors calls for implementation of 450mm manufacturing in 2012, and Kramer believes that if the industry is to have any chance of meeting that timeline, serious planning must begin now with an industry consensus developed that will work for all committed parties.
Program details are still under development, with major elements of the 450mm program to include member-driven collaboration on development of industry guidance for both 300mm and 450mm manufacturing; use of ISMI’s Industry Economic Model and other modeling tools to provide fiscal guidelines for 300mm development and 450 mm insertion; and assessment of industry readiness for wafer-size transition.
Kramer explained that 300mm aims at improving productivity not only for existing 300mm fabs, but also for future 300mm fabs and next-wafer-size facilities. For example, all three types of facilities can incorporate e-manufacturing, which ISMI has pioneered.
“Through 300mm, we expect to generate immediate, mid-term and long-term benefits for all of our members,” he said.
ISMI said it will provide more data on its vision of 300mm and 450mm at several public meetings in the upcoming year with supplier inputs to be sought.
“We view this transition as a multi-year effort that will involve a great deal of dialogue, compromise, and consensus-building. Above all, it should be a gradual and economical process, well planned and well executed. This is a marathon, not a sprint,” Kramer concluded.
