Peer into technology's future
iNEMI road map set to tackle disruptive technologies
by Barbara Jorgensen -- EDN, April 1, 2006
In 1996 the National Electronics Manufacturers Initiative (NEMI) identified the phaseout of lead as one of the key issues the electronics industry would be dealing with in the coming years. In 2006 lead-free manufacturing is a reality.
"Back then we identified the lack of a lead-free solder as a gap in technology," says Jim McElroy, president of iNEMI—the i, which was added in 2005, stands for international. "In 1999 we began our first project, to identify what kind of solder could replace lead.
Along with the industry group IPC, iNEMI was instrumental in developing and testing the tin-silver-copper and tin-copper solders widely used as lead-solder substitutes today.
iNEMI, which comprises mainly electronics manufacturing services (EMS) providers and OEMs, is not a standards-setting body, but its efforts often result in standards that are adopted by the industry. Most recently iNEMI and the IPC released IPC 1750, a proposal that would standardize the way the industry declares that its products are free of lead and other materials banned by the European Union's Restriction of Hazardous Substances (RoHS). The groups also came together on the issue of part numbering, calling for component manufacturers to identify RoHS-compliant devices with new identification numbers, rather than just modifying the old ones.
Environmental issues figure prominently on iNEMI's 2007 road map, which the group released in January 2006. McElroy says the term road map is really a misnomer: Road maps are best at tracking the evolution of existing technologies. iNEMI's road map aims to identify both future disruptive technologies and gaps in current technologies.
"We are trying to put more emphasis on disruptive areas, and by understanding where there currently are gaps in technology, you get a good idea of where disruption may come from," says McElroy.
The iNEMI road map is divided into Technology Working Groups (TWGs) and Product Emulation Groups (PEGs) that are chaired by volunteers from the electronics industry, academia and government. The PEGs work on identifying what technologies may be needed for their particular product group; the TWGs work on developing those technologies and seeing if they can be applied across industries. Road map topics vary, depending on member interest. For example, organic semiconductors have been added to the 2007 road map. Nanotechnology, which was identified as a disruptive technology on NEMI's last road map in 2004, appears again on the 2007 road map.
On environmental issues, the group is working to become more proactive than reactive, McElroy says.
"There are currently six substances banned by RoHS, but we also see environmental changes being proliferated in China, California, Japan and other places, and the challenge is that all are spinning off in slightly different directions," says Mark Newton, senior consultant for Dell.
Although the industry is committed to becoming environmentally friendly, it also needs to develop consistent methods to ensure compliance as well as materials that are available and cost-effective and that have the right technical qualities and supply chain readiness. Also, Newton adds, the industry has to avoid using a substance that might be as harmful as one that is banned. "It's possible that the substance you move to may be more hazardous; the only difference is that it hasn't been legislated against," he says.
During the current cycle of the road map (the road map spends two to three years on the same topic), the environmental TWG will most likely be looking at the flame retardants banned by RoHS, as well as mercury, which is used in liquid crystal displays.
McElroy and Newton stress that the road map will take the direction of its membership. Says McElroy, "These are ideas and areas for industry collaboration and to figure out how we can close gaps in technology—the map itself is not the endgame."
Click here for informatiuon about upcoming iNEMI workshops.
