Taiyo Yuden claims that its newest MLCC (multilayer-ceramic-chip capacitor) is the first to pack 2.2 μF in the EIA 0402 case size. This doubling of capacitance results from advances in material technology, fabrication, and crystalline structure, thus reducing the size of the dielectric particles to less than 0.2 microns and the dielectric layer to less than 1 micron (Picture). The 1×0.5×0.5-mm device can replace 1.6×0.8×0.8-mm 0603-size capacitors of the same rating, offering the same capacitance in a smaller footprint. For designs requiring the ubiquitous 10-μF rating, the vendor uses the same technology in a 0603 package. The 2.2-μF, ±20% units cost 10 cents each, and the 10-μF units cost 20 cents (small quantities).
The leading US manufacturer of machined interconnect components. Product line includes spring-loaded contacts, SIP, DIP, PGA and BGA sockets, board-to-board interconnects and pin headers, surface mount and application specific products, PCB pins...
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