Ultratech acquires patent rights to IBM wafer annealing technology
The agreement covers US and foreign patents for a portfolio including hardware for thermal processing of semiconductor wafers, as well as patents for temperature control and metrology.
By Ann Steffora Mutschler, Senior Editor -- EDN, October 9, 2008
To strengthen and broaden its annealing technology capability for ultra-shallow junction (USJ) formation, a critical step in semiconductor manufacturing, San Jose-based semiconductor manufacturing lithography tool company Ultratech Inc said today it has acquired the rights to a collection of patents from IBM Corp that cover fundamental technology for rapid thermal annealing.
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The companies did not disclose the financial details of the deal.
The agreement covers US and foreign patents for a portfolio including hardware for thermal processing (annealing) of semiconductor wafers, as well as patents for temperature control and metrology, Ultratech said.
“Ultratech has periodically purchased patents that it views are key to our business. The acquisition of these patents from IBM is the continuation of that strategy to ensure that our customers receive the highest technology content in their products. This acquisition reinforces our commitment to remain at the forefront of providing equipment with leading-edge technology and low cost-of-ownership advantages for our global customer base,” concluded Ultratech Chairman and CEO Arthur W. Zafiropoulo, in a statement.
