SMIC receives US licenses for 32-nm production
As early of January 1, the foundry can launch 32-nm logic process development in all of its own manufacturing facilities and can start 32-nm flash R&D in its 300-mm fab in Wuhan, China.
By Suzanne Deffree, Managing Editor, News -- EDN, October 27, 2008
Shanghai-based SMIC (Semiconductor Manufacturing International Corp) today announced that it will officially enter the 32-nm technology era in January 2009.
The foundry said that under US government export license rules it can launch 32-nm logic process development as early as January 1 in all of its own manufacturing facilities.
In addition, SMIC said that under individual validated licenses recently granted by the US it can start 32-nm flash R&D as early as January 1 in the 300-mm fab that it manages and operates in Wuhan (dubbed Wuhan Xinxin International Corp).
"SMIC is happy to gain the 32-nm approvals, which provide us the flexibility to deliver our technology advancement and fortify our leadership position in China," Matthew Szymanski, VP for corporate relations and manager of export compliance for SMIC, said in a statement today.
Withholding detail, SMIC also said that it recently entered into an agreement with Spansion "to consider the manufacture" of 32-nm flash memory in 2010. SMIC already has an agreement for 65-nm and 43-nm MirrorBit flash with Spansion.
Further, SMIC announced last week that it has developed 0.11-micron CIS (CMOS image sensor) process technology.
