IMEC, Qualcomm to research 3D integration
The 3D technical research program focuses on 3D wafer-level packaging and 3D stacked ICs to find applications for the cost-effective use of 3D interconnects at different levels of the wiring hierarchy in a chip, and aims to include the development and demonstration of the IP and tools necessary for designing in three dimensions.
By Ann Steffora Mutschler, Senior Editor -- EDN, July 14, 2008
To understand and develop solutions for the use of 3D technologies in future wireless products, Leuven, Belgium-based nanoelectronics research institute IMEC said today that San Diego, Calif.-based wireless chip provider Qualcomm Inc is the first fabless IC company to participate in IMEC’s industrial affiliation program on 3D integration.
IMEC explained that its 3D technical research program focuses on 3D wafer-level packaging and 3D stacked ICs to find applications for the cost-effective use of 3D interconnects at different levels of the wiring hierarchy in a chip, and aims to include the development and demonstration of the IP and tools necessary for designing in three dimensions.
With Qualcomm joining the 3D integration program, IMEC said all the major supply chain players are working together and believes that industry collaboration among foundries, IDMs, packaging and assembly companies, and equipment suppliers at IMEC will push the development of innovative 3D products forward.
Jim Clifford, senior VP and general manager of Qualcomm CDMA Technologies said three-dimensional design will allow Qualcomm to offer superior features and performance in its products.
Other partners the program include Amkor, Infineon, Intel, Micron, NEC, NXP, Panasonic, Qimonda, Samsung, ST Microelectronics, Texas Instruments and TSMC.
