STATS ChipPAC to manufacture Infineon eWLB
The agreement follows on a separate agreement between Infineon, STATS ChipPAC, and STMicroelectronics to jointly develop the next-generation of embedded Wafer-Level Ball Grid Array technology, based on Infineon's first-generation technology.
By Suzanne Deffree, Managing Editor, News -- EDN, August 28, 2008
STATS ChipPAC Ltd will provide manufacturing services to Infineon Technologies AG for the company’s first-generation embedded Wafer-Level Ball Grid Array (eWLB) technology.
STATS ChipPAC, a semiconductor test and advanced packaging service provider, said the eWLB manufacturing services will be located at its operation in Yishun, Singapore, and described eWLB as fan out wafer level packaging technology that alleviates constraints brought on by the lack of physical pad connection space.
“eWLB is an innovative technology that offers a high performance, power efficient solution for the wireless market,” Han Byung Joon, STATS ChipPAC CTO, said in a statement Wednesday. “With our extensive manufacturing expertise in advanced integration technology, we are looking forward to working with Infineon to achieve volume production of this revolutionary packaging technology.”
Added Wah Teng Gan, VP of assembly and test at Infineon Asia Pacific, in the statement, “Infineon introduced the first generation of eWLB in 2007 as a dynamic technology that offered small package dimensions, improved electrical and thermal performance, and maximum connection density for wireless applications. Our manufacturing partnership with STATS ChipPAC ensures we will be able to expand the number of highly integrated wafer level packages manufactured with eWLB technology.”
The manufacturing partnership comes just as the ink on another agreement between the two companies is drying. Earlier this month, Infineon granted license to its eWLB technology to STATS ChipPAC, as well as to STMicroelectronics. As part of that accord, the trio agreed to jointly develop the next-generation of eWLB technology, based on Infineon’s first-generation technology. An accompanying R&D effort will focus on using both sides of a reconstituted wafer to manufacture semiconductor devices with a higher integration level and a greater number of contact elements. The resulting IP will be owned by the three companies.
