ASE to leverage SUSS MicroTec’s litho equipment in wafer level packaging ops
By Ann Steffora Mutschler, Senior Editor -- EDN, November 22, 2007
Driven by market demands for faster, smarter, portable and integrated electronic products, semiconductor assembly and test services provider ASE Group said this week it will use lithography production equipment from Munich, Germany-based SUSS MicroTec including several production mask aligners and coat/bake/develop clusters for 200 mm and 300mm, in its move towards more sophisticated semiconductor applications.
The equipment is to be installed at ASE’s wafer level packaging and redistribution process facility in Kaohsiung, Taiwan.
The companies reminded that wafer level packaging is an advanced packaging technology whereby the die and package are manufactured and tested on the wafer, then diced into individually packaged ICs.
D.Y. Chen, VP of advanced packaging operations at ASE Kaohsiung said as a result of its more towards more sophisticated semiconductor application, the company has to rely on production equipment that allows high yields, unmatched throughput and cost effectiveness.
