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TI, SMIC Ink 90nm Deal

By Suzanne Deffree -- EDN, October 29, 2004

Semiconductor Manufacturing International Corp. has struck a deal with Texas Instruments to produce 90nm logic wafers.

On its earnings call today, the Chinese foundry said it has ordered tools to produce 90nm designs, with shipments due in the current quarter and pilot production expected in Q1 2005.

"The development is on track. Overall we are schedule to achieve 125,000 8-inch equivalent wafers per month by year-end 2004," Richard Chang, SMIC's president and CEO, said in reference to the foundry's total business.

Independently, TI has been focused on 90nm. The company last week announced it was ramping its Dallas 300mm fab to 90nm. At that time, TI had said it planned to extend its outside 90nm partnerships, but did not detail any specific moves.

SMIC did not disclose financial details of the deal. For more on SMIC's Q3, click here.

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