System offers thermal and stress analysis for electronic systems
By Gabe Moretti -- EDN, January 22, 2004
Designers of electronic systems are finding that mechanical issues are frequently becoming a major issue in product development, especially in RF design. To address these issues, Ansoft has introduced ePhysics, which works with its Maxwell 3D and HFSS to help engineers cope with thermal and stress issues (Picture). Designers can use power- and core-loss information they obtain from Maxwell or HFSS as an input source for thermal problems to obtain a complete thermal profile of a device. The tool uses nonlinear steady-state and transient thermal-analysis techniques to determine the temperature profile of the enclosure that is in direct contact with the electronics.
Engineers can analyze the structural deformation due to the temperature rise on materials using the ePhysics linear-stress-analysis engine. The engine accepts input from the both the Thermal analysis portion and from the Maxwell tool to analyze stress due to electromagnetic force, short-circuit-induced mechanical stress, and structural stress due to temperature. Using power-loss figures from the HFSS, ePhysics determines the corresponding temperature distribution and selects appropriate steps to calculate the corresponding deformation and structural stress in microwave and RF components. The product is available on Windows, Solaris, and HP-UX operating systems. Prices start at $19,900.
Ansoft Corp, www.ansoft.com.
