Interface material overcomes that sinking feeling
By Bill Schweber -- EDN, January 24, 2002
Using the Thermflow T766 phase-change material from Chomerics, you get both a low thermal-resistance path between your hot IC and its heat sink and the ability to remove that heat sink for repair and rework (Picture). The material, a layering of a tacky, electrically nonconductive phase-change film and conformable metal foil, attaches to heat sinks or spreaders; the solid film softens at the component's operating temperature to fill minute air gaps for a better thermal path. The foil layer lets you easily remove the heat sink if necessary without force or sticky residue.
Thermal impedance of this material is 0.04°C-in.2/W. It is available in custom sizes as well as standard 0.70-, 1-, and 1.25-in.-sq sizes to match common processor packages; prices begin at 8 cents (high volumes).
Chomerics, Division of Parker Hannifin Corp, 1-781-935-4850, www.chomerics.com.
