Thermal-interface material changes phase to smooth heat flow

Bergquist's new compliant material ensures low thermal impedance between hot ICs and their heat sinks and avoids messy "bleeding" of the adhesive. The Hi-Flow 225UF comprises a 3-mil (0.076-mm)-thick adhesive phase-change material with a 1-mil (0.025-mm)-thick foil coating to ease all-too-common rework (Picture). Overall thermal impedance of 0.69W/m-K. The material is available in kiss-cut sheet form and standard squares and rectangles; the vendor also offers custom sizes and shapes. Hi-Flow 225UF costs 15 cents/sq in. (2.3 cents/sq cm).

Bergquist Co, 1-800-347-4572, www.bergquistcompany.com.