Advertisement

Zibb

News and New Products

Package extends the capabilities of development tools

By Gabe Moretti -- EDN, 2/19/2004

Impulse Accelerated Technologies has released the CoDeveloper C-language-design tool for programmable platforms based on the Altera (www.altera.com) Nios and Xilinx (www.xilinx.com) MicroBlaze embedded processors. The product complements Altera’s Quartus II and SOPC Builder products for the Nios processor and Xilinx Platform Studio tool for the MicroBlaze processor. The CoDeveloper hardware/software-design tool allows engineers to use C to develop applications for FPGA devices. CoDeveloper includes compiler tools that provide the necessary C-to-RTL compilation path, as well as automated generation of interfaces for the MicroBlaze or the Nios processors. The tool allows engineers to use Microsoft (www.microsoft.com) Visual Studio, Metrowerks (www.metrowerks.com) CodeWarrior, or other GCC (Gnu Compiler Collection)-based tools when performing simulations and debugging.

In addition to generating hardware representations in the form of HDL files and of hardware/software interfaces, the CoDeveloper tool exports files, including platform-specific run-time libraries, HDL components, and Tcl scripts to either the Altera Quartus or the Xilinx Platform Studio environment.

CoDeveloper for Nios and CoDeveloper for MicroBlaze sell for $4995 each for a permanent single-user license. You can purchase a one-year term license for either product for $1995. The universal version, which supports both Altera and Xilinx, is available for a one-time license fee of $8995.

Impulse Accelerated Technologies, 1-866-446-7857, www.impulsec.com.



Reed Business Information Resource Center

Featured Company


Related Resources

ADVERTISEMENT

ADVERTISEMENT

Feedback Loop


Post a CommentPost a Comment

There are no comments posted for this article.

Related Content

 

By This Author


ADVERTISEMENT

Knowledge Center



Technology Quick Links

EDN Marketplace


©1997-2010 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy