AMD, IBM Expand Semiconductor Alliance

Online staff -- Electronic News, 11/1/2005

Microprocessor innovator Advanced Micro Devices (AMD) and IBM have broadened the scope of their technology alliance through 2011 to include early exploratory research of transistor, interconnect, lithography, and die-to-package connection technologies.

IBM noted this agreement marks the first time a member of a technology development alliance will work directly with its research division on R&D, electronic materials, and basic feasibility studies three to five years before commercialization. This also now creates one of IBM’s longest semiconductor alliances.

Since early exploratory research is a critical component of microprocessor R&D, the collaboration is meant to allow both companies to identify and investigate future technology challenges earlier, allowing solutions to be found and fundamental technology choices to be made sooner.

“The industry-leading performance, power-efficiency and function of our AMD64 processors is made possible through a constant, uninterrupted cycle of improvements to our integrated circuit process technologies,” explained Craig Sander, corporate VP of technology development at AMD, in a statement.

“By expanding our successful IBM alliance, we can significantly increase our level of early-stage research, focusing on technologies for the 32nm and 22nm technology generations,” he continued.

“By influencing and participating in this research, AMD can better align its process technologies with the needs of our products scheduled to be introduced late in this decade and beyond,” Sander added.

Bernie Meyerson, IBM Fellow, VP and chief technologist for IBM’s systems and technology group noted, “This agreement is a perfect example of IBM's strategy of collaborative innovation. Working closely with our key development associates like AMD, we are able to bring advanced technology to market faster and more economically, providing added benefit to our customers.”

R&D will take place in three locations: at IBM’s Watson Research Center in Yorktown Heights, N.Y., the Center for Semiconductor Research at Albany NanoTech, and at IBM’s 300mm manufacturing facility in East Fishkill, N.Y., the companies concluded.