Renesas Technology plans to develop the SH-Mobile G Series, an integrated platform with software and dual-mode application processors, for 3G mobile phones. The company expects to complete the joint project with NTT Docomo (www.nttdocomo.com), Fujitsu (www.fujitsu.com), Mitsubishi Electric (www.mitsubishi.com), and Sharp (www.sharp.com) by the second quarter of the 2007 fiscal year. Renesas expects the dual-mode platform to expand its SH-Mobile SOC (system-on-chip) business, including W-CDMA (wideband-code-division-multiple-access) technology from NTT Docomo and GSM/GPRS (Global System for Mobile communications/General Packet Radio Service) from European companies.

SH-Mobile G2 will support broader-band communication systems than its predecessor, SH-Mobile G1, and will also support HSDPA (high-speed-downlink-packet access) as fast as 3.6 Mbps and EDGE (Enhanced Data for GSM Evolution) at its baseband circuit. The G2 will become available for sampling in July 2006 to the OEMs of Fujitsu, Mitsubishi, and Sharp. The G2 chip will enter volume production in the second quarter of 2007.

The platform comprises SymbianOS as an operating system and an MOAP (mobile-phone-oriented application platform) from NTT Docomo. Renesas plans to later support Linux. The platform also comprises the SH-Mobile G2 hardware chip, device drivers, middleware, communication-control software, OS, and application software.