GE, Tokki to develop PECVD film encapsulation for OLED displays

By Ann Steffora Mutschler -- Electronic News, 3/2/2007

Niskayuna, N.Y.-based GE Global Research, the centralized research organization for the General Electric Co. reported today it has signed an agreement with Tokyo-based OLED manufacturing equipment supplier Tokki Corp. to develop PECVD film encapsulation technology and equipment for manufacturing organic electronics such as organic light emitting diode (OLED) flat panel displays.

The equipment based on the technology resulting from this collaboration is expected to serve as the foundation for the future manufacturing and sale of glass-based displays that are thinner in design and much lower in cost.

As part of the agreement, GE Global Research says it will license its patented PECVD film encapsulation process to Tokki for use in the company’s OLED manufacturing equipment.

Since OLED devices require a high degree of hermetic sealing or "encapsulation," as moisture and oxygen can impede the devices’ functionality, the encapsulation technology is seen as a critical component for enabling future OLED devices and process technology that are much thinner in design, while still protected from environmental degradation, the companies noted.

Anil Duggal, advanced technology program leader for organic electronics at GE Global Research said in a statement, “A key to this effort will be successfully incorporating the unique encapsulation technology developed at Global Research into the manufacturing process.”

A primary focus of the project will be to successfully develop and demonstrate pilot line manufacturing equipment that successfully incorporates Global Research’s film encapsulation technology with the ultimate goal to build manufacturing equipment for OLED displays that can be sold commercially.

Kenichi Tsugami, president of Tokki added, “Our success on this project could greatly expand market opportunities for OLED flat panel displays and create new markets in organic electronics."