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-- EDN, 6/5/2007

Ask the Embedded Flash Expert by Toshiba

The trend of feature-rich electronic product development is driving the need for higher density data storage. Increasingly, designers are turning to Flash-based storage to solve embedded product design challenges. But what kind of Flash solution? What are the technology choices that best suit your application? In this series from Toshiba, you have a trusted source and industry pioneer for all things Flash. So go ahead, Ask the Embedded Flash Expert.

	What is embedded NAND? Embedded NAND refers to NAND flash memory installed on the system...
	What are the advantages of NAND Flash for embedded storage? NAND Flash memory is the preferred non-volatile data storage solution today...
	What embedded applications are best suited for NAND Flash? Embedded NAND is often a good fit for high volume consumer electronics devices...
	How do single-package embedded MLC NAND solutions with a built-in controller simplify design? Embedded NAND solutions that include a memory controller to handle MLC NAND...
	When is MLC NAND appropriate for an embedded NAND application? MLC NAND is appropriate for most consumer applications to store video...
	What level of ECC do I need to use for embedded NAND? As NAND Flash memory advances to smaller process geometries at 56nm and...
	What is LBA-NAND™? (Logical Block Address-NAND) LBA-NAND, developed by Toshiba, is a single-package embedded...

Toshiba To Ship 56-Nanometer NAND Flash Memories Toshiba Outlines Four-Pronged Strategy for Addressing the Embedded NAND Flash Market Toshiba Adds GB NAND™ Flash With Controller For Embedded Storage Applications Toshiba Adds New High Performance SDHC Cards and High Capacity microSD Card to Extensive Memory Card Line-up

MLC NAND Solutions
Toshiba offers four single-package embedded MLC NAND solutions that enable designers to easily integrate the cost/performance advantages of high-density MLC NAND in embedded designs. By combining high-density MLC NAND and the controller function in the same package, the need for host software drivers and memory management functions is minimized and the time to market is reduced.

LBA-NAND™
Toshiba LBA-NAND™ is a single-package Flash solution that combines high-density MLC NAND and a memory controller with logical block addressing, error correction code (ECC), wear-leveling, block management, and a standard NAND interface. Available in capacities from 2GB to 8GB, LBA-NAND™ features a simple write/read memory that enables easy integration of MLC NAND into new or existing embedded Flash designs using lower density SLC NAND.
eMMC™ NAND Flash™
Ranging from 1GB to 16GB in capacity, Toshiba's eMMC embedded MLC solutions integrate a dedicated controller and are fully compliant with the MultiMediaCard Association (MMCA) Ver. 4.2 high speed memory standard for memory cards. The products support standard interfacing, a maximum data transfer rate of 52MB/sec, and simplifies integration into system designs. Advantages of Toshiba Embedded LBA-NAND™ Solution

GB NAND
For designers who prefer an SD interface, Toshiba GB NAND is a single-package solution combining an SD memory controller, (ECC), wear-leveling and block management with MLC NAND Flash memory. GB NAND uses an SD bus, allowing easy design of products using a open SD interface.

Multi-Chip Package Solutions
Toshiba multi-chip packages (MCP) offer combinations from two to six chips of NAND Flash, NOR Flash, Pseudo SRAM (PSRAM) and low power SDRAM in a single package to simplify layout and save valuable board space in cellular phones and other space-constrained mobile electronics devices. As a leader in MCPs that incorporate NAND Flash for high-volume consumer applications, Toshiba has developed two additional embedded NAND options in addition to conventional MCPs.

GB MCP
The Toshiba Gigabyte multi-chip package (GB MCP) is ideally suited for today's multimedia phones that require large memory capacity to support data storage multimedia functions such as high-resolution cameras and music players. It includes MLC NAND flash memory in capacities up to 2GB with a controller supporting an SD interface. It can be integrated into MCPs that stack standard memory for cellular handsets, including LP SDRAM + NAND Flash and PSRAM + NOR Flash memory.

Package-on-Package
This enhanced MCP technology saves significant circuit board space in cellular handsets and other mobile devices by stacking a high-density memory component on top of the processor so the two components require only one footprint on the board. Toshiba is offering Low Power SDRAM and high-density NAND Flash PoP configurations in various PoP packages.

More From Toshiba's Embedded Flash Expert Toshiba Embedded Memory Products Home Page Removable NAND Storage Solutions SDCard Brochure Company Overview Flash Article Archives Multi-Level Cell NAND Flash - The Consumer Choice Fast Future for Flash Meet Different Needs with NAND and NOR	LBA-NAND and GB-NAND are trademarks of TOSHIBA Corporation. eMMC is a trademark of the MultiMediaCard Association. All other trademarks and tradenames held within are the properties of their respective holders.

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