Qualcomm tapes out 45-nm chip

By Ann Steffora Mutschler, Senior Editor -- Electronic News, 8/1/2007

San Diego, Calif.-based Qualcomm Inc. reported today that it has taped out its first 45-nm chip on a low power-optimized manufacturing process that incorporates advanced immersion lithography and very low k inter-metal dielectrics features.

The fabless wireless communications chipmaker noted that the technology is meant to allow competitive performance, significant cost efficiency, with improved performance on leakage and integration.

Qualcomm also said it has also begun developing its 40-nm process technology, expected to deliver even greater benefits in terms of semiconductor performance, cost and efficiency.

Behrooz Abdi, senior VP and general manager for Qualcomm reminded that the company’s relationships with foundry partners continues to support its technology innovation. The company utilizes what it terms an integrated fabless manufacturing business model that allows close collaboration with strategic technology and foundry partners, aimed at greater efficiencies and accelerated technology advancement to the industry.

Other technology leaders use a similar strategy including Texas Instruments. CTO Dr. Hans Stork recently discussed TI’s approach in detail.