IBM licenses 45-nm bulk CMOS process to SMIC

Under a licensing agreement, the Shanghai-based foundry can use IBM’s bulk CMOS technology to fabricate devices in mobile applications such as handsets integrated with 3G, multimedia, graphics chips as well as chipsets at the 45 nm manufacturing process node.

By Ann Steffora Mutschler, Senior Editor -- Electronic News, 12/26/2007

Armonk, N.Y.-based technology giant International Business Machines (IBM) reported today that it has licensed its 45 nm bulk CMOS manufacturing technology to mainland China’s largest semiconductor wafer foundry, Semiconductor Manufacturing International Corp. (SMIC), for use in 300 mm wafer foundry services. 

Under the agreement, IBM said the Shanghai-based foundry can use its bulk CMOS technology to fabricate devices in mobile applications such as handsets integrated with 3G, multimedia, graphics chips as well as chipsets at the 45 nm manufacturing process node.

The technology can also support the manufacturing of graphics and other consumer devices, Big Blue noted.

"China is a rapidly growing, strategic marketplace and SMIC is the largest Chinese foundry," said Kevin Hutchings, vice president of IP Licensing for IBM.

Matthew Szymanski, VP of corporate relations for SMIC said in a statement, “Coupled with IBM’s expertise on design enabler and system IP comprehension, SMIC can transition fabless customers to SoC design for the 45 nm node era.”

SMIC said this agreement complements its ongoing research and development progress, including its 65 nm low-power technology, currently going through customer product qualification.

Earlier this month, SMIC began production in its Fab 8, which it claims is Shanghai’s first 12-inch wafer fab. The fab is part of the science and education project (Ke Jiao Xin Shi) promoted by the Shanghai Municipal Government to encourage productivity and competitive development.

And in October, the U.S. Commerce Department’s Bureau of Industry and Security approved five companies in China for “validated end-user” status including Applied Materials, National Semiconductor and SMIC, in order to help increase bilateral high technology trade while maintaining a secure U.S. export control by removing individual license requirements on exports of certain U.S.-controlled items to certain companies.