Post a CommentIBM, Rohm and Haas expand partnership to include 32-, 22-nm copper CMP
The technology players are collaborating on new copper CMP dielectrics for the 32- and 22-nm manufacturing nodes.
By Ann Steffora Mutschler, Senior Editor -- Electronic News, 2/27/2008
To bolster high volume manufacturing of the 32- and 22-nm semiconductor manufacturing process nodes, IBM Corp and the Phoenix, Ariz.-based chemical mechanical planarization (CMP) technologies division of Rohm and Haas Electronic Materials said today they will work together on CMP process development for the integration of copper and low-k dielectrics.
Under terms of their agreement, the companies said they will create a CMP consumables to allow high volume manufacturing of 32 and 22 nm devices.
On Monday, the companies announced another agreement meant to facilitate semiconductor implant at and below the 32 nm semiconductor manufacturing process node, to create patterning materials and processes.
The development of CMP consumables for advanced technology nodes is becoming extremely complicated and successful CMP process development for the 32 and 22 nm nodes requires a complete understanding of the interaction between pad, slurry and conditioner under various process conditions, the companies said.
Currently, Rohm and Haas said its development efforts are focused on low-stress polishing that can operate at extreme conditions to achieve high volume, reproducible processes, and offers application-specific CMP consumables and breakthrough technologies to address next generation process nodes while maintaining the low cost of ownership demanded by device manufacturers.
Research for the joint development will take place at IBM's Research facility in Yorktown Heights, NY, as well as the UAlbany NanoCollege’s Albany NanoTech Complex and Rohm and Haas’s Technology Centers in Newark, DE and Phoenix, Ariz.
Dr. Jeffrey Hedrick, senior manager semiconductor process technology at IBM Research noted in a statement, “As the complexity of the technology increases, innovations in pad and slurry technologies are essential for successful manufacturing. Combining Rohm and Haas's world renowned consumables expertise with IBM's extensive knowledge of CMP process technology will help address future CMP technology challenges.”
Rohm and Haas pointed out that IBM has been a customer and collaboration partner for more than 30 years, and was the first company to introduce CMP into the semiconductor manufacturing process.
Sam Shoemaker, president of Rohm and Haas Electronic Materials, CMP technologies said, “Since then, our partnership has yielded several industry-standard platforms for CMP polishing pads. We expect this new collaboration with IBM can help solve some critical copper integration challenges that will benefit IBM and its customers, and ultimately result in technology advancements that will benefit the semiconductor industry.”
