Post a CommentIBM, Hitachi to research near-atomic-scale chip characteristics
The industry giants also work on enterprise servers and other products.
By Ann Steffora Mutschler, Senior Editor -- Electronic News, 3/10/2008
To speed the pace of semiconductor innovation and investigate the possibilities for even further transistor scaling, International Business Machines Corp (IBM) and Hitachi Ltd said today they have inked a two-year joint semiconductor metrology research agreement, marking the first time the industry giants have collaborated on semiconductor technology.
IBM and Hitachi reminded that they currently work on enterprise servers and other products.
Since the miniaturization of transistors is a driving force in improving the performance of computer chips, and is being pursued in the development of next-generation 32- and 22-nm devices, the feature size of such minute devices is in the realm of billionths of a meter, and effects at this scale can have a large impact on the electrical characteristics of individual transistors, the companies explained.
As such, the companies said they will focus on 32-nm and smaller semiconductor research and will use new methods that include the latest technologies to analyze semiconductor devices and structures to improve the characterization and measurement of transistor variation, as well as to develop a better understanding of device physics.
Engineers from the companies along with Hitachi’s subsidiary, Hitachi High-Technologies, will conduct joint research at IBM's Thomas J. Watson Research Center in Yorktown Heights, NY and at the College of Nanoscale Science and Engineering’s Albany NanoTech Complex.
Bernie Meyerson, VP of strategic alliances and CTO for IBM’s systems and technology group noted in a statement, “Hitachi’s cutting-edge semiconductor characterization capabilities, and IBM's state-of-the-art CMOS research capabilities can help the two companies accelerate the pace of semiconductor innovation for the 32-nanometer generation and beyond. By combining individual research strength and intellectual property we reduce the significant costs associated with research needed to advance the next generation of chip technology.”
Also, Hitachi’s VP and executive officer, general manager of the company’s R&D group, Eiji Takeda, added, “Hitachi’s significant expertise in analytical instrumentation and semiconductor physics can promote industry-leading research for next generation semiconductor technology.”
In other 32-nm and below efforts on behalf of IBM, the company announced late last month that it is working with Rohm and Haas on both 32- and 22-nm copper CMP, as well as semiconductor manufacturing implant lithography technology.
For commentary on today's news from EDN Executive Editor Ron Wilson, please see this Practical Chip Design blog entry, "IBM invites Hitachi into its ecosystem for 32 nm."
