Intel, LSI team for advanced RAID data protection

In other storage news, Advanced Micro Devices announces availability of the first reference design kit based on the Athlon processor for the storage bridge bay 2.0 specification.

By Ann Steffora Mutschler, Senior Editor -- Electronic News, 4/7/2008

To redefine how advanced RAID data protection is deployed on future Intel Corp Xeon-based server and workstation platforms, Intel and LSI Corp have inked a multi-generation agreement that covers technical collaboration on Intel’s RAID technology, codenamed “Treemont,” and LSI’s MegaRAID software.

Building on a collaboration that goes back to 1999, the resulting technology from the companies is meant to allow advanced data protection for business-critical data that resides on Intel servers and workstations.

Intel’s Treemont technology is an open architecture built on a foundation of Intel’s multi-core technology, virtualization, advanced RAID processing, and storage interfaces, and is designed to optimize data protection and performance, while making advanced RAID solutions widely accessible to businesses of all sizes, Intel explained.

Meanwhile, LSI MegaRAID software is meant to provide robust data protection and availability, fault prevention, and recovery for business critical data. When utilizing the features of the Treemont architecture, MegaRAID capabilities will be available to a broader range of Intel servers and workstations.

“With this collaboration we are redefining how advanced data protection will be deployed on Intel Xeon server and workstation platforms,” Diane Bryant, VP of Intel’s digital enterprise group and general manager of Intel’s server platforms group, said in a statement today.

“With MegaRAID being the preferred solution for Treemont technology, LSI is well positioned to deliver the trusted protection and reliability of this proven software across an even broader range of platforms," Phil Bullinger, executive VP of LSI’s Engenio storage group, added in the statement. "By working closely with Intel, OEMs and system builders will now have greater platform options to choose from to meet customers' performance and data protection requirements.”

In other storage news, Intel rival Advanced Micro Devices (AMD) announced availability of the first reference design kit (RDK) based on its Athlon processor for the storage bridge bay (SBB) 2.0 specification. the kit is meant to simplify the design process and provide a standardized platform based on AMD’s direct connect architecture. 

AMD said it expects to help storage vendors deliver low power, high performance, entry-level networked storage systems while helping reduce time-to-market, allowing them to focus more on specific innovations that their customers require. 

AMD's SBB RDK is meant to give storage vendors a highly configurable platform with the exceptional data throughput capabilities of AMD Athlon and AMD Athlon X2 dual-core processors featuring direct connect architecture and HyperTransport technology to allow for differentiated systems based on customer needs while addressing the need for high memory and I/O bandwidth in networked storage environments.

The RDK supports network attached storage (NAS), storage area networks (SAN), unified storage systems, as well as all major interface connectivity options including GigE, 10GigE, Fibre Channel, and Infiniband. The RDK includes schematics and layout source files, with reference design hardware to be available from AMD partner Newisys Data Storage.

AMD also announced an expansion of its embedded product offerings with three new, low-power AMD Athlon X2 dual-core processors for embedded system designs meant to enhance the options for deploying AMD technology in embedded systems that span from entry-level networked storage systems designed with the new RDK to other high-performance embedded designs including telecommunications solutions, digital signage, and point of sale, gaming, and kiosk systems. 

The new AMD Athlon X2 dual-core processor models 3400e, 3600+ and 4200+ are aimed at greater levels of performance in the same low-power envelopes of 22, 35, and 35W maximum thermal design power, respectively.

The chips are expected to be availabile in Q2 with embedded industry-standard component longevity of five years.