Zibb

Consolidation among mobile-IC makers squeezes supply chain

Edited by Suzanne Deffree -- EDN, 11/13/2008

Continuing the considerable consolidation in the mobile-IC supply chain, Freescale Semiconductor announced a planned exit from the cellular-handset-chip-set market. The company in October said that it is exploring its options for the business, including the unit’s sale or the formation of a joint venture, just weeks after STMicroelectronics announced it would buy out NXP’s share of its ST-NXP Wireless joint venture. That August-launched company effectively saw NXP end its mobile-IC work. ST then merged in EMP (Ericsson Mobile Platforms), creating a formidable competitor to the wireless industry’s mobile-semiconductor kingpins, including Qualcomm.

Analysts believe that, with Freescale’s move, more opportunity could open to Qualcomm, however. As part of its action, Freescale updated its mobile-IC arrangement with Motorola whereby Motorola agreed to provide certain consideration in exchange for eliminating Freescale’s remaining minimum-purchase commitments.

“In recent reports, we have highlighted the theme of [Qualcomm’s] benefiting from rapid consolidation of the wireless-semi industry,” wrote Tim Luke, a semiconductor-market analyst at Barclays Capital, in a research note.

Freescale is seeking to increase its investments in the automotive and networking markets, as well as in the industrial and consumer markets. “In the cellular-handset-chip-set market, it has become evident that this business needs considerably greater scale … to achieve a position of market leadership and long-term success,” says Rich Beyer (photo), Freescale’s chief executive officer. Freescale’s cellular-handset-products business includes baseband processors, RF transceivers, power management/audio, software, and platforms.



Reed Business Information Resource Center

Featured Company


Related Resources

ADVERTISEMENT

ADVERTISEMENT

Feedback Loop


Post a CommentPost a Comment

There are no comments posted for this article.

Related Content

 

By This Author


ADVERTISEMENT

Knowledge Center


Events

IMI's 6th Annual Security Printing Conference
Dates: 11/16/2009 - 11/18/2009
Location: Baltimore, Maryland, USA

International Approvals Roundtable
Dates: 12/8/2009 - 12/8/2009
Location: Portland, OR

International Approvals Roundtable
Dates: 12/10/2009 - 12/10/2009
Location: Seattle, WA

Oxford University Practical RF/Microwave Design Short Course
Dates: 1/18/2010 - 1/22/2010
Location: Oxford, United Kingdom

CDMA and EV-DO Technology
Dates: 2/8/2010 - 2/10/2010
Location: San Jose, CA

Submit an EventSubmit an Event




Technology Quick Links

EDN Marketplace


©1997-2009 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy

Please visit these other Reed Business sites