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Wednesday, June 18, 2008
OnChip Devices SiC0101: Miniature silicon-chip capacitor has low profile
Jun 18 2008 12:00AM | Permalink | Email this | Comments (0) |
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The miniature, wire-bondable SiC0101 silicon-chip capacitor has a wire-bondable pad on the top and metallization on the back, allowing the use of epoxy die. The capacitor aims at RF-microwave, multichip-module, and hybrid-microelectronics applications. Sandwiched between two metal plates, the capacitor has a layer of silicon-nitride dielectric film providing a 4.7- to 22-pF capacitance. The vendor claims that the device has a frequency range of 1 MHz to several gigahertz. Measuring 0.25×0.25-mm, the capacitor comes as thin as 0.1 mm with additional thickness on the same footprint. Prices for the SiC0101 range from 1 to 2 cents (50,000), depending on capacitance value, tolerance, and chip thickness.
OnChip Devices, www.onchip.com
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