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Recent Posts

• Sonics offers another way to approach DRAM controller complexity: in the interconnect architecture
• ChipX ventures further into mixed-signal ASICs
• Good enough data compression: Samplify could open the door to novel uses
• RF integration: another point of view from Analog Devices
• LSI/Tarari: watching fine structure emerge in application of deep packet inspection
• Seen at DAC: are iPhone and Android showing the direction of tomorrow's handset architectures?
• Cadence stalks Mentor: a possible explanation. (And no, it's not strategic.)
• At VLSI Symposium NEC shows novel thermal monitor for SoCs
• More from DAC: Can IP assembly ever be a real methodology for SoC design?
• Overheard at DAC: Dynamic IR drop and noise: doing something about the awful edges

Recent Comments

• 7abib on Latest from DAC: Managing Intel's Atom design for low power
• ron on Good enough data compression: Samplify could open the door to novel uses
• LarryM on Good enough data compression: Samplify could open the door to novel uses
• kalya on Nintendo Wii wireless problem illustrates RF communications issues
• pitch monk on Cadence stalks Mentor: a possible explanation. (And no, it's not strategic.)

Most Commented On

• The Tata People’s Car and the promise of automotive electronics (18)
• There’s lots of silicon in photovoltaic cells, but is there any gold for the electronics industry? (15)
• Cadence stalks Mentor: a possible explanation. (And no, it's not strategic.) (12)
• Nintendo Wii wireless problem illustrates RF communications issues (11)
• Micron, Blackstone, China and the DRAM world (10)

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