EDN Executive Editor Ron Wilson explores how IC design teams really work: the struggle for power efficiency and performance, wrestling with semiconductor processes and design methodologies, the challenges of global design teams. How do we somehow herd architecture, IP, design and verification into a successful tape-out?
Profile
Recent Posts
- Thinking about active audio noise cancellation in SoCs
- Automotive applications for Ethernet are coming
- Testing some limits for mixed-signal ASICs at e2v
- Jennic stalks 802.15.4 into non-consumer markets
- Real scientists have fabs: PREMA's 11-mask BiCMOS process
- Electronics and the economy: a view from Electronica
- When an ASIC vendor partners with an EDA vendor: a new model
- Fujitsu launches RF CMOS at 65 nm
- USB 3.0 SuperSpeed IP puts a date on the next USB technology node
- Look in with envy: a strip-down report on Samsung's DDR3 65 nm DRAM
Recent Comments
- RT on Automotive applications for Ethernet are coming
- Schoko on Economists, mathematics, and where the semiconductor industry is headed this year
- Ian Proffitt on Automotive applications for Ethernet are coming
- Brandon on Automotive applications for Ethernet are coming
- Fulhorst on Automotive applications for Ethernet are coming
Most Commented On
- Heard at Hot Chips: As design outsourcing matures, a potential problem is emerging (29)
- The Tata People’s Car and the promise of automotive electronics (21)
- Cadence: the picture gets darker (18)
- There’s lots of silicon in photovoltaic cells, but is there any gold for the electronics industry? (15)
- Will global recession hand the equipment industry to China? (12)
Archives
- November 2008
- October 2008
- September 2008
- August 2008
- July 2008
- June 2008
- May 2008
- April 2008
- March 2008
- February 2008
- January 2008
- December 2007
- November 2007
- October 2007
- September 2007
- August 2007
- July 2007
- June 2007
- May 2007
- April 2007
- March 2007
- February 2007
- January 2007
- December 2006
- November 2006
- October 2006
- September 2006
By Category
- 3G (3)
- Analog (6)
- Asia (2)
- ASICs (9)
- ASICs (9)
- ATE (4)
- Automatic test equipment (ATE) (1)
- Automotive (1)
- Automotive & Aerospace Test (1)
- Best practices (1)
- Bluetooth (2)
- Broadband (1)
- Broadband (3)
- Business and Marketing (25)
- Capital Equipment (6)
- China (1)
- Code development & Debugging (1)
- Communication functions (1)
- Components, Hardware, Interconnect (2)
- Compression Algorithms (1)
- Computers, boards, buses (1)
- Configurable Processor (1)
- Connected Home (2)
- Consumer Electronics (3)
- Convergence (5)
- Converters (4)
- DAC (1)
- DAC (1)
- Debugging (1)
- Defense (1)
- Design (1)
- Design and Technology (13)
- Design for Test/Built-in Self-Test (1)
- Design Strategies (12)
- Digital ICs (11)
- DSP (5)
- Economics (4)
- EDA (34)
- Electronics Licensing & Technology Agreements (1)
- Embedded Systems (1)
- Emerging Technologies (1)
- Environmental Compliance (1)
- Etching (1)
- Executive Changes (1)
- Failure Analysis (1)
- Fiber-optic (1)
- Fibre Optics (2)
- Filter (1)
- Finance (3)
- Flip Chip Technology (4)
- Global (6)
- Global Supply and Trade (1)
- Globalization (1)
- Government/Legal (5)
- Home Gateway (1)
- Home Network (1)
- Image Processing (1)
- Inspection, Measurement and Test (1)
- Interface and level conversion (1)
- IP (1)
- IP (13)
- Joint Ventures (1)
- LAN (1)
- LANs (2)
- Licensing & Technology Agreements (4)
- Lithography (9)
- Low-k (1)
- Management (1)
- Manufacturing Operations (5)
- Marketing (1)
- Materials Science (1)
- Memory components (14)
- Mergers and Acquisitions (4)
- Microcontroller (1)
- Microcontrollers (1)
- Microelectronics and Packaging (5)
- Microprocessor (1)
- Microprocessors (7)
- Microscopy (1)
- Mobile (7)
- Music/Audio (1)
- Network processors (2)
- Outsourcing (1)
- Packaging (2)
- Politics & Policy (1)
- Power Sources/Controllers (3)
- Processors (10)
- Processors & Tools (1)
- Programmable Analog (1)
- Programmable Logic (15)
- Regulatory Issues (1)
- Research (5)
- RF (4)
- Security (1)
- Semiconductor Test (1)
- Semiconductors (41)
- Set-top Box (1)
- Signal Integrity (3)
- Silicon (5)
- Simulation (3)
- SOC (4)
- SOC (2)
- SOC (1)
- SOC (System on a chip) (145)
- Software (6)
- Spice (1)
- Standard busses (1)
- Standards (1)
- Standards (2)
- Storage devices (1)
- Structured ASICs (5)
- Synthesis (1)
- System-level Design Language (6)
- Systems on Chip (3)
- Test Bench (1)
- Thermal Management (1)
- Venture Capital & IPOs (1)
- Verification (6)
- Video (2)
- Video/DTV (8)
- Wafer Processing (1)
- WiMax (1)
- Wire Bond (3)
- Wired (2)
- Wireless (7)
- Yield Management (1)
August 2008
Thursday, Aug 28, 2008
Wednesday, Aug 27, 2008
Tuesday, Aug 26, 2008
Monday, Aug 25, 2008
Monday, Aug 18, 2008
Tuesday, Aug 12, 2008
Monday, Aug 11, 2008
Tuesday, Aug 5, 2008
ADVERTISEMENT
About Us | Contact Us | Free Email Newsletters | Free Magazine Subscription | Advertising | 
RSS
©1997-2008 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy