Profile

• About Me

Recent Posts

• Memcon panel explores low-power main-memory choices
• Altera spins Cyclone with low-power, design protection, and redundancy
• Mentor upgrades Catapult-C to deal with control logic and power management
• LSI brings LDPC technology to disk read-channels
• Solido adds well-proximity estimation to Variation Designer
• Calypto works with Virage on managing memory power
• Cypress, SpectraLinear go almost head-to-head on clock ICs
• CPU power management, systems architecture and market share: a not-so-subtle interaction
• Intel's Mayberry sketches in the roadmap for Intel process evolution
• Toshiba, TSMC show different directions at VLSI Symposium

Recent Comments

• Bracelet on Cadence turns to alliances to extend two flows
• sebastina mont on The Tata People's Car may come to North America
• Old_Engineer on Silicon Frontline: taking on the emerging challenges in extraction
• Siddharth Rao on Cypress, SpectraLinear go almost head-to-head on clock ICs
• basic optics on Heard at SemiCon West: what lies beyond double-patterning lithography: EUV, e-beam, imprint technology, or the end of history?

Most Commented On

• India's $20 laptop plan challenges our thinking about system design (60)
• Why the layoffs if we're still profitable? (39)
• The Tata People's Car may come to North America (36)
• Heard at Hot Chips: As design outsourcing matures, a potential problem is emerging (33)
• The Tata People’s Car and the promise of automotive electronics (24)

Archives

• June 2009
• May 2009
• April 2009
• March 2009
• February 2009
• January 2009
• December 2008
• November 2008
• October 2008
• September 2008
• August 2008
• July 2008
• June 2008
• May 2008
• April 2008
• March 2008
• February 2008
• January 2008
• December 2007
• November 2007
• October 2007
• September 2007
• August 2007
• July 2007
• June 2007
• May 2007
• April 2007
• March 2007
• February 2007
• January 2007
• December 2006
• November 2006
• October 2006
• September 2006

By Category

• 3G (3)
• Analog (11)
• Asia (2)
• ASICs (10)
• ASICs (10)
• ATE (4)
• Automatic test equipment (ATE) (1)
• Automotive (1)
• Automotive & Aerospace Test (1)
• Best practices (1)
• Bluetooth (2)
• Broadband (1)
• Broadband (3)
• Business and Marketing (38)
• Capital Equipment (8)
• China (1)
• Code development & Debugging (1)
• Communication functions (3)
• Compiler (1)
• Components, Hardware, Interconnect (3)
• Compression Algorithms (1)
• Computers, boards, buses (2)
• Configurable Processor (1)
• Connected Home (2)
• Connecting Technologies (1)
• Consumer Electronics (4)
• Convergence (5)
• Converters (5)
• DAC (1)
• DAC (1)
• Debugging (1)
• Defense (1)
• Design (1)
• Design and Technology (13)
• Design for Test/Built-in Self-Test (1)
• Design Strategies (17)
• Digital ICs (15)
• DSP (1)
• DSP (6)
• Economics (5)
• EDA (60)
• Electronics Licensing & Technology Agreements (1)
• Embedded Systems (3)
• Emerging Technologies (1)
• Environmental Compliance (1)
• Etching (1)
• Executive Changes (1)
• Failure Analysis (1)
• Fiber-optic (1)
• Fibre Optics (3)
• Filter (1)
• Finance (3)
• Flip Chip Technology (5)
• Global (7)
• Global Supply and Trade (1)
• Globalization (2)
• Government/Legal (5)
• HDL (1)
• Home Gateway (1)
• Home Network (1)
• Image Processing (1)
• India (1)
• Inspection, Measurement and Test (1)
• Interface and level conversion (1)
• IP (1)
• IP (23)
• Joint Ventures (1)
• LAN (1)
• Languages (1)
• LANs (2)
• Licensing & Technology Agreements (6)
• Lithography (14)
• Low-k (1)
• Management (2)
• Manufacturing Operations (5)
• Marketing (1)
• Materials Science (1)
• Memory components (16)
• Mergers and Acquisitions (5)
• Microcontroller (1)
• Microcontrollers (2)
• Microelectronics and Packaging (5)
• Microprocessor (1)
• Microprocessors (8)
• Microscopy (1)
• Mobile (10)
• Music/Audio (1)
• Network processors (2)
• Outsourcing (2)
• Packaging (2)
• Phase-Locked Loop (1)
• Physical-layer interface (1)
• Politics & Policy (1)
• Power Sources/Controllers (5)
• Processors (11)
• Processors & Tools (3)
• Programmable Analog (1)
• Programmable Logic (22)
• Reconfigurable and reuse (1)
• Regulatory Issues (1)
• Research (6)
• RF (6)
• Security (1)
• Semiconductor Test (2)
• Semiconductors (51)
• Set-top Box (1)
• Signal Integrity (4)
• Silicon (5)
• Simulation (6)
• SOC (1)
• SOC (6)
• SOC (2)
• SOC (System on a chip) (184)
• Software (9)
• Software Development Tools (3)
• Spice (1)
• Standard busses (4)
• Standards (1)
• Standards (2)
• Storage devices (2)
• Structured ASICs (5)
• Synthesis (1)
• System-level Design Language (6)
• Systems on Chip (5)
• Test Bench (2)
• Thermal Management (1)
• Venture Capital & IPOs (1)
• Verification (15)
• Vertical Markets (1)
• Video (3)
• Video/DTV (9)
• Wafer Processing (1)
• WiMax (1)
• Wire Bond (3)
• Wired (5)
• Wireless (13)
• Yield Management (1)