EDN Executive Editor Ron Wilson explores how IC design teams really work: the struggle for power efficiency and performance, wrestling with semiconductor processes and design methodologies, the challenges of global design teams. How do we somehow herd architecture, IP, design and verification into a successful tape-out?
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Recent Posts
- A look into the future of FPGAs with Xilinx's Gavrielov and Rangasayee
- Semiconductors, emerging markets, and the self-interest of survival
- Femtocell reference design from picoChip heralds new phase in wireless buildout
- Data centers, shipping containers, and the future of access networks
- Arteris expands their approach to Networks on Chips
- Intel's Borkar hints at future of SoC architecture and semiconductor test
- ITC panel highlights pioneering work of Stanford Center for Reliable Computing
- Altera Cyclone IV parts signal direction of the global-recession industry
- Gennum offers a study in leading-edge mixed-signal design
- PMC-Sierra takes aim at carrier Ethernet with a new OTN chip
Recent Comments
- Manoj Gunwani on A look into the future of FPGAs with Xilinx's Gavrielov and Rangasayee
- Steve Meier on A look into the future of FPGAs with Xilinx's Gavrielov and Rangasayee
- Chuck Blevins on A look into the future of FPGAs with Xilinx's Gavrielov and Rangasayee
- Used Solar Panel >> Where to find used s on Synopsys pulls together its verification platforms
- Dietroly on Getting a grip on cloud computing: NVIDIA, the Playstation-3, and big iron
Most Commented On
- India's $20 laptop plan challenges our thinking about system design (66)
- A solar-panel glut could be a golden opportunity (48)
- Why the layoffs if we're still profitable? (43)
- The Tata People's Car may come to North America (36)
- Heard at Hot Chips: As design outsourcing matures, a potential problem is emerging (33)
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