EDN Executive Editor Ron Wilson explores how IC design teams really work: the struggle for power efficiency and performance, wrestling with semiconductor processes and design methodologies, the challenges of global design teams. How do we somehow herd architecture, IP, design and verification into a successful tape-out?
Advertisement
Profile
RSS Feed
-
Add this blog to your RSS newsreader!
Recent Posts
- Hynix, Innovative Silicon show floating-body DRAM on bulk silicon
- Magma Tekton: rethinking static timing analysis
- TierLogic lifts the veil: another take on the 3D FPGA
- Open SystemC Initiative releases analog/mixed-signal extensions standard
- ARM show new AMBA specs: think FPGAs and multicore
- SoCs stalk the networking market, and global finance is an issue
- The future of SoCs: software as differentiator and demon
- Actel SmartFusion blends FPGA, programmable analog, and an ARM MCU
- What happens after "I'm sorry:" the world of product engineering
- SpringSoft brings more smarts to Certitude
Recent Comments
- engineer on Hynix, Innovative Silicon show floating-body DRAM on bulk silicon
- FB-Memory on Hynix, Innovative Silicon show floating-body DRAM on bulk silicon
- marwa on Software-defined radio becomes cognitive radio in IMEC roadmap
- doctormcgoveran on Toyota Prius and Camry, drive-by-wire, and our failure to learn from experience
- صور سك on When is it restructuring, and when is it just a layoff?
Most Commented On
- Toyota Prius and Camry, drive-by-wire, and our failure to learn from experience (85)
- India's $20 laptop plan challenges our thinking about system design (80)
- A solar-panel glut could be a golden opportunity (48)
- Why the layoffs if we're still profitable? (46)
- Outsource everything! A panel looks to the limits of outsourcing (43)
Archives
- March 2010
- February 2010
- January 2010
- December 2009
- November 2009
- October 2009
- September 2009
- August 2009
- July 2009
- June 2009
- May 2009
- April 2009
- March 2009
- February 2009
- January 2009
- December 2008
- November 2008
- October 2008
- September 2008
- August 2008
- July 2008
- June 2008
- May 2008
- April 2008
- March 2008
- February 2008
- January 2008
- December 2007
- November 2007
- October 2007
- September 2007
- August 2007
- July 2007
- June 2007
- May 2007
- April 2007
- March 2007
- February 2007
- January 2007
- December 2006
- November 2006
- October 2006
- September 2006
By Category
- 3G (3)
- Analog (18)
- Asia (2)
- ASICs (11)
- ASICs (10)
- ATE (6)
- Automatic test equipment (ATE) (1)
- Automotive (1)
- Automotive & Aerospace Test (1)
- Best practices (1)
- Bluetooth (2)
- Broadband (1)
- Broadband (10)
- Business and Marketing (67)
- Capital Equipment (9)
- Career Center (1)
- China (1)
- Code development & Debugging (1)
- Communication functions (9)
- Compiler (1)
- Components, Hardware, Interconnect (3)
- Compression Algorithms (1)
- Computers, boards, buses (2)
- Configurable Processor (1)
- Connected Home (2)
- Connecting Technologies (1)
- Consumer Electronics (5)
- Convergence (5)
- Converters (5)
- DAC (1)
- DAC (1)
- Debugging (1)
- Defense (1)
- Design (1)
- Design and Technology (13)
- Design for Test/Built-in Self-Test (1)
- Design Strategies (17)
- Digital ICs (19)
- DSP (1)
- DSP (9)
- Economics (5)
- EDA (96)
- Electronics Licensing & Technology Agreements (1)
- Embedded Systems (6)
- Emerging Technologies (1)
- Encryption and security (1)
- Environmental Compliance (1)
- Etching (1)
- Executive Changes (1)
- Failure Analysis (2)
- Fiber-optic (1)
- Fibre Optics (5)
- Filter (1)
- Finance (3)
- Flip Chip Technology (5)
- Global (8)
- Global Supply and Trade (1)
- Globalization (2)
- Government/Legal (9)
- HDL (1)
- Home Gateway (1)
- Home Network (1)
- Image Processing (1)
- India (1)
- Inspection, Measurement and Test (1)
- Interface and level conversion (1)
- IP (1)
- IP (32)
- Joint Ventures (1)
- LAN (1)
- Languages (1)
- LANs (2)
- Licensing & Technology Agreements (6)
- Lithography (16)
- Low-k (1)
- Management (2)
- Manufacturing Operations (7)
- Marketing (1)
- Materials Science (1)
- Memory components (18)
- Mergers and Acquisitions (6)
- Microcontroller (1)
- Microcontrollers (3)
- Microelectronics and Packaging (5)
- Microprocessor (1)
- Microprocessors (10)
- Microscopy (1)
- Mixed Signal (1)
- Mobile (10)
- Music/Audio (1)
- Network processors (2)
- Outsourcing (3)
- Packaging (2)
- Phase-Locked Loop (1)
- Physical-layer interface (1)
- Politics & Policy (1)
- Power Sources/Controllers (5)
- Processors (11)
- Processors & Tools (5)
- Programmable Analog (1)
- Programmable Logic (30)
- Reconfigurable and reuse (1)
- Regional Markets (1)
- Regulatory Issues (1)
- Research (7)
- RF (7)
- Security (1)
- Semiconductor Test (2)
- Semiconductors (75)
- Set-top Box (1)
- Signal Chain (1)
- Signal Integrity (4)
- Silicon (5)
- Simulation (7)
- SOC (1)
- SOC (2)
- SOC (7)
- SOC (System on a chip) (226)
- Software (10)
- Software Development Tools (3)
- Spice (1)
- Standard busses (5)
- Standards (1)
- Standards (3)
- Storage devices (4)
- Structured ASICs (5)
- Synthesis (1)
- System-level Design Language (7)
- Systems on Chip (5)
- Test Bench (3)
- Thermal Management (1)
- Venture Capital & IPOs (1)
- Verification (18)
- Vertical Markets (1)
- Video (3)
- Video/DTV (9)
- Wafer Processing (1)
- WiMax (1)
- Wire Bond (3)
- Wired (5)
- Wireless (17)
- Yield Management (1)
Blog
ADVERTISEMENT
About Us | Contact Us | Free Email Newsletters | Free Magazine Subscription | Advertising | 
RSS
©1997-2010 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy