EMC, RFI, SI consultant Henry Ott has a new book

I quoted famous signal-integrity consultant Henry Ott in my next article about galvanic isolation. While poking around his web site I noticed a page that talks about his next book, “Electromagnetic Compatibility Engineering”. I have mentioned Ott’s classic “Noise Reduction Techniques in Electronic Systems” several times, as have Jim Williams and others. When I asked Henry about the new book he said, “It is almost 900 pages, and took me three and a half years to write. My new book has a whole chapter on Mixed-Signal PCB Layout, as well as a chapter on Digital PCB Stackup considerations for 4 to 12 layer boards. Both contain material you will not find elsewhere.”  From his web page:

Electromagnetic Compatibility Engineering stands out from other EMC books in a number of ways:

1. The comprehensiveness of the coverage. While still containing all the normal EMC subjects such as cabling, shielding, grounding, digital circuit layout, and ESD, Electromagnetic Compatibility Engineering includes coverage of:

    •    Equipment/Systems Grounding

    •    Balancing and Filtering

    •    Passive Components

    •    Radiated Emissions

    •    Conducted Emission

    •    Switched-Mode Power Supplies

    •    Variable-Speed Motor Drives

    •    Harmonic Emission

    •    Digital Circuit Decoupling

    •    PCB Layout and Stackup

    •    Mixed Signal PCB Layout

    •    RF and Transient Immunity

    •    Power Line Disturbances

    •    Pre-Compliance EMC Measurements

    •    EMC Regulations

    •    Contact Protection

    •    Intrinsic and Active Device Noise Sources

    •    The Theory of Partial Inductance

2. The critical balance between theory and practical applications. Most EMC books either overemphasize the theoretical aspects of EMC, swamping the reader with mathematics and the derivation of equations, or give “cook book” solutions to EMC problems with little or no theory to back them up. Electromagnetic Compatibility Engineering strikes a critical balance by providing sufficient theory for the reader to be able to understand the principle being discussed, but no more than necessary. In this way the reader understands “why” the principle is applicable, and is therefore capable of applying the theory to other situations.

3. The clarity of the writing. Complex issues are broken down into their fundamental parts and explained in a very straightforward easily understood manner. The primary objective of the book has been to explain the subject in a manner easily understood by the typical product design engineer. In other words, I wrote the book so I could understand it.

4. Considerable new and unique material. For example, the measurements of ground plane inductance, the exact ground plane current distribution for microstrip, stripline and asymmetrical stripline transmission lines, how digital logic currents actually flow in a PCB, the use of embedded PCB capacitance for decoupling, mixed-signal PCB layout, and the appendix on the theory of partial inductance. Much of this material is not available elsewhere.

Henry also gives us the detailed table of contents:

Preface Part 1, EMC Theory 1. Electromagnetic Compatibility

1.1 Introduction

1.2 Noise and Interference   

1.3 Designing for Electromagnetic Compatibility

1.4 Engineering Documentation and EMC

1.5 United States’ EMC Regulations

    1.5.1 FCC Regulations

    1.5.2 FCC Part 15, Subpart B

    1.5.3 Emissions

    1.5.4 Administrative Procedures

    1.5.5 Susceptibility

    1.5.6 Medical Equipment

    1.5.7 Telecom

    1.5.8 Automotive   

1.6 Canadian EMC Requirements

1.7 European Union’s EMC Requirements

    1.7.1 Emission Requirements

    1.7.2 Harmonics and Flicker

    1.7.3 Immunity Requirements

    1.7.4 Directives and Standards

1.8 International Harmonization

1.9 Military Standards

1.10 Avionics

1.11 The Regulatory Process

1.12 Typical Noise Path

1.13 Methods of Noise Coupling

    1.13.1 Conductively Coupled Noise   

    1.13.2 Common Impedance Coupling

    1.13.3 Electric and Magnetic Field Coupling

1.14 Miscellaneous Noise Sources

    1.14.1 Galvanic Action

    1.14.2 Electrolytic Action   

    1.14.3 Triboelectric Effect   

    1.14.4 Conductor Motion

1.15 Use of Network Theory

Summary

Problems

References

Further Reading

2. Cabling

2.1 Capacitive Coupling

2.2 Effect of Shield on Capacitive Coupling

2.3 Inductive Coupling

2.4 Mutual Inductance Calculations   

2.5 Effect of Shield on Magnetic Coupling

    2.5.1 Magnetic Coupling Between Shield and Inner Conductor

    2.5.2 Magnetic Coupling–Open Wire to Shielded Conductor

2.6 Shielding to Prevent Magnetic Radiation   

2.7 Shielding a Receptor Against Magnetic Fields

2.8 Common Impedance Shield Coupling

2.9 Experimental Data

2.10 Example of Selective Shielding

2.11 Shield Transfer Impedance

2.12 Coaxial Cable Versus Twisted Pair

2.13 Braided Shield

2.14 Spiral Shields

2.15 Shield Terminations

    2.15.1 Pigtails

    2.15.2 Grounding of Cable Shields

2.16 Ribbon Cables

2.17 Electrically Long Cables

Summary

Problems

References

Further Reading

3. Grounding

3.1 AC Power Distribution and Safety Grounds

    3.1.1 Service Entrance

    3.1.2 Branch Circuits

    3.1.3 Noise Control

    3.1.4 Earth Grounds

    3.1.5 Isolated Grounds

    3.1.6 Separately Derived Systems

    3.1.7 Grounding Myths

3.2 Signal Grounds

    3.2.1 Single-Point Ground Systems   

    3.2.2 Multipoint Ground Systems

    3.2.3 Common Impedance Coupling

    3.2.4 Hybrid Grounds

    3.2.5 Chassis Grounds

3.3 Equipment/System Grounding

    3.3.1 Isolated Systems

    3.3.2 Clustered Systems

    3.3.3 Distributed Systems

3.4 Ground Loops

3.5 Low-Frequency Analysis of Common-Mode Choke

3.6 High-Frequency Analysis of Common-Mode Choke

3.7 Single Ground Reference For a Circuit

Summary

Problems

References

Further Reading

4. Balancing and Filtering

4.1 Balancing

    4.1.1 Common-Mode Rejection Ratio

    4.1.2 Cable Balance

    4.1.3 System Balance

    4.1.4 Balanced Loads

4.2 Filtering

4.2.1 Common-Mode Filters

4.2.2 Parasitic Effects in Filters

4.3 Power Supply Decoupling

    4.3.1 Low-Frequency Analog Circuit Decoupling

    4.3.2 Amplifier Decoupling

4.4 Driving Capacitive Loads

4.5 System Bandwidth

4.6 Modulation and Coding

Summary

Problems

References

Further Reading

5. Passive Components

5.1 Capacitors

    5.1.1 Electrolytic Capacitors

    5.1.2 Film Capacitors

    5.1.3 Mica and Ceramic Capacitors

    5.1.4 Feed-Through Capacitors

    5.1.5 Paralleling Capacitors

5.2 Inductors

5.3 Transformers

5.4 Resistors

    5.4.1 Noise in Resistors

5.5 Conductors

    5.5.1 Inductance of Round Conductors

    5.5.2 Inductance of Rectangular Conductors

    5.5.3 Resistance of Round Conductors

    5.5.4 Resistance of Rectangular Conductors

5.6 Transmission Lines

    5.6.1 Characteristic Impedance

    5.6.2 Propagation Constant

    5.6.3 High-Frequency Loss

    5.6.4 Relationship Among C, L, and εr

    5.6.5 Final Thoughts

5.7 Ferrites

Summary

Problems

References

Further Reading

6. Shielding

6.1 Near Fields and Far Fields

6.2 Characteristic and Wave Impedances

6.3 Shielding Effectiveness

6.4 Absorption Loss

6.5 Reflection Loss

    6.5.1 Reflection Loss to Plane Waves

    6.5.2 Reflection Loss in the Near Field

    6.5.3 Electric Field Reflection Loss   

    6.5.4 Magnetic Field Reflection Loss

    6.5.5 General Equation for Reflection Loss

    6.5.6 Multiple Reflections in Thin Shields

6.6 Composite Absorption and Reflection Loss

    6.6.1 Plane Waves

    6.6.2 Electric Fields

    6.6.3 Magnetic Fields

6.7 Summary of Shielding Equations

6.8 Shielding With Magnetic Materials

6.9 Experimental Data

6.10 Apertures

    6.10.1 Multiple Apertures

    6.10.2 Seams

    6.10.3 Transfer Impedance   

6.11 Waveguide Below Cutoff

6.12 Conductive Gaskets

    6.12.1 Joints of Dissimilar Metals

    6.12.2 Mounting of Conductive Gaskets

6.13 The “Ideal” Shield

6.14 Conductive Windows   

    6.14.1 Transparent Conductive Coatings

    6.14.2 Wire Mesh Screens

    6.14.3 Mounting of Windows

6.15 Conductive Coatings

    6.15.1 Conductive Paints

    6.15.2 Flame/Arc Spray

    6.15.3 Vacuum Metalizing   

    6.15.4 Electroless Plating

    6.15.5 Metal Foil Linings

    6.15.6 Filled Plastics

6.16 Internal Shields

6.17 Cavity Resonance

6.18 Grounding of Shields

Summary

Problems

References

Further Reading

7. Contact Protection

7.1 Glow Discharges

7.2 Metal-Vapor or Arc Discharges   

7.3 AC Versus DC Circuits

7.4 Contact Material

7.5 Contact Rating

7.6 Loads With High Inrush Currents

7.7 Inductive Loads

7.8 Contact Protection Fundamentals

7.9 Transient Suppression for Inductive Loads

7.10 Contact Protection Networks for Inductive Loads

    7.10.1 C Network   

    7.10.2 R-C Network

    7.10.3 R-C-D Network

7.11 Inductive Loads Controlled by a Transistor Switch

7.12 Resistive Load Contact Protection

7.13 Contact Protection Selection Guide

7.14 Examples

Summary

Problems

References

Further Reading

8. Intrinsic Noise Sources

8.1 Thermal Noise

8.2 Characteristics of Thermal Noise

8.3 Equivalent Noise Bandwidth

8.4 Shot Noise

8.5 Contact Noise   

8.6 Popcorn Noise

8.7 Addition of Noise Voltages

8.8 Measuring Random Noise

Summary

Problems

References

Further Reading

9. Active Device Noise

9.1 Noise Factor

9.2 Measurement of Noise Factor

    9.2.1 Single-Frequency Method

    9.2.2 Noise Diode Method   

9.3 Calculating S/N Ratio and Input Noise Voltage From

       Noise Factor

9.4 Noise Voltage and Current Model

9.5 Measurement of Vn and In

9.6 Calculating Noise Factor and S/N Ratio From Vn–In

9.7 Optimum Source Resistance

9.8 Noise Factor of Cascaded Stages

9.9 Noise Temperature

9.10 Bipolar Transistor Noise

    9.10.1 Transistor Noise Factor

    9.10.2 Vn-In for Transistors   

9.11 Field-Effect Transistor Noise

    9.11.1 FET Noise Factor

    9.11.2 Vn-In Representation of FET Noise  

9.12 Noise in Operational Amplifiers

    9.12.1 Methods of Specifying Op-Amp Noise

    9.12.2 Op-Amp Noise Factor

Summary

Problems

References

Further Reading

10. Digital Circuit Grounding

10.1 Frequency Versus Time Domain

10.2 Analog Versus Digital Circuits

10.3 Digital Logic Noise

10.4 Internal Noise Sources

10.5 Digital Circuit Ground Noise

    10.5.1 Minimizing Inductance

    10.5.2 Mutual Inductance

    10.5.3 Practical Digital Circuit Ground Systems

    10.5.4 Loop Area   

10.6 Ground Plane Current Distribution and Impedance

    10.6.1 Reference Plane Current Distribution

    10.6.2 Ground Plane Impedance

    10.6.3 Ground Plane Voltage

    10.6.4 End Effects

10.7 Digital Logic Current Flow

    10.7.1 Microstrip Line

    10.7.2 Stripline

    10.7.3 Digital Circuit Current Flow Summary

Summary

Problems

References

Further Reading

Part 2, EMC Applications 11. Digital Circuit Power Distribution

11.1 Power Supply Decoupling

11.2 Transient Power Supply Currents

    11.2.1 Transient Load Current

    11.2.2 Dynamic Internal Current

    11.2.3 Fourier Spectrum of the Transient Current

    11.2.4 Total Transient Current

11.3 Decoupling Capacitors

11.4 Effective Decoupling Strategies

11.4.1 Multiple Decoupling Capacitors

11.4.2 Multiple Capacitors of the Same Value

    11.4.3 Multiple Capacitors of Two Different Values

    11.4.4 Multiple Capacitors of Many Different Values

    11.4.5 Target Impedance

    11.4.6 Embedded PCB Capacitance   

    11.4.7 Power Supply Isolation

11.5 The Effect on Decoupling on Radiated Emissions

11.6 Decoupling Capacitor Type and Value

11.7 Decoupling Capacitor Placement and Mounting

11.8 Bulk Decoupling Capacitors

11.9 Power Entry Filters

Summary

Problems

References

Further Reading

12. Digital Circuit Radiation

12.1 Differential-Mode Radiation

    12.1.1 Loop Area   

    12.1.2 Loop Current

    12.1.3 Fourier Series

    12.1.4 Radiated Emission Envelope   

12.2 Controlling Differential-Mode Radiation

    12.2.1 Board Layout

    12.2.2 Canceling Loops

    12.2.3 Dithered Clocks

12.3 Common-Mode Radiation

12.4 Controlling Common-Mode Radiation

    12.4.1 Common-Mode Voltage

    12.4.2 Cable Filtering and Shielding

    12.4.3 Separate I/O Grounds

    12.4.4 Dealing With Common-Mode Radiation Issues

Summary

Problems

References

Further Reading

13. Conducted Emissions

13.1 Power Line Impedance

    13.1.1 Line Impedance Stabilization Network

13.2 Switched-Mode Power Supplies

    13.2.1 Common-Mode Emissions

    13.2.2 Differential-Mode Emissions

    13.2.3 DC-To-DC Converters

    13.2.4 Rectifier Diode Noise

13.3 Power-Line Filters

    13.3.1 Common-Mode Filtering

    13.3.2 Differential-Mode Filtering

    13.3.3 Leakage Inductance   

    13.3.4 Filter Mounting

    13.3.5 Power Supplies With Integral Power-Line Filters

    13.3.6 High-Frequency Noise

13.4 Primary-to-Secondary Common-Mode Coupling   

13.5 Frequency Dithering

13.6 Power Supply Instability

13.7 Magnetic Field Emissions

13.8 Variable Speed Motor Drives

13.9 Harmonic Suppression

    13.9.1 Inductive Input Filters

    13.9.2 Active Power Factor Correction

    13.9.3 AC Line Reactors

Summary

Problems

References

Further Reading

14. RF and Transient Immunity

14.1 Performance Criteria

14.2 RF Immunity

    14.2.1 The RF Environment

    14.2.2 Audio Rectification   

    14.2.3 RFI Mitigation Techniques

14.3 Transient Immunity

    14.3.1 Electrostatic Discharge

    14.3.2 Electrical Fast Transient

    14.3.3 Lightning Surge

    14.3.4 Transient Suppression Networks

    14.3.5 Signal Line Suppression

    14.3.6 Protection of High-Speed Signal Lines

    14.3.7 Power Line Transient Suppression

    14.3.8 Hybrid Protection Network

14.4 Power Line Disturbances

    14.4.1 Power Line Immunity Curve   

Summary

Problems

References

Further Reading

15 Electrostatic Discharge   

15.1 Static Generation

    15.1.1 Inductive Charging

    15.1.2 Energy Storage

15.2 Human Body Model

15.3 Static Discharge

    15.3.1 Decay Time

15.4 ESD Protection in Equipment Design

15.5 Preventing ESD Entry

    15.5.1 Metallic Enclosures   

    15.5.2 Input/Output Cable Treatment

    15.5.3 Insulated Enclosures

    15.5.4 Keyboards and Control Panels

15.6 Hardening Sensitive Circuits

15.7 ESD Grounding

15.8 Nongrounded Products

15.9 Field-Induced Upset

    15.9.1 Inductive Coupling

    15.9.2 Capacitive Coupling

15.10 Transient Hardened Software Design

    15.10.1 Detecting Errors in Program Flow

    15.10.2 Detecting Errors in Input/Output

    15.10.3 Detecting Errors in Memory

15.11 Time Windows

Summary

Problems

References

Further Reading

16. PCB Layout and Stack-Up

16.1 General PCB Layout Considerations

    16.1.1 Partitioning

    16.1.2 Keep Out Zones

    16.1.3 Critical Signals

    16.1.4 System Clocks

16.2 PCB-to-Chassis Ground Connection

16.3 Return Path Discontinuities

    16.3.1 Slots in Ground/Power Planes

    16.3.2 Split Ground/Power Planes

    16.3.3 Changing Reference Planes

    16.3.4 Referencing the Top and Bottom of the Same Plane

    16.3.5 Connectors

    16.3.6 Ground Fill

16.4 PCB Layer Stackup

16.4.1 One- and Two-Layer Boards   

16.4.2 Multilayer Boards

16.4.3 General PCB Design Procedure

Summary

Problems

References

Further Reading

17. Mixed-Signal PCB Layout

17.1 Split Ground Planes

17.2 Microstrip Ground Plane Current Distribution

17.3 Analog and Digital Ground Pins

17.4 When Should Split Ground Planes be Used?

17.5 Mixed Signal ICs

    17.5.1 Multi-Board Systems

17.6 High-Resolution A/D and D/A Converters

    17.6.1 Stripline

    17.6.2 Asymmetric Stripline

    17.6.3 Isolated Analog and Digital Ground Planes

17.7 A/D and D/A Converts Support Circuitry

    17.7.1 Sampling Clocks

    17.7.2 Mixed-Signal Support Circuitry

17.8 Vertical Isolation

17.9 Mixed-Signal Power Distribution

    17.9.1 Power Distribution

    17.9.2 Decoupling

17.10 The IPC Problem

Summary

Problems

References

Further Reading

18. Precompliance EMC Measurements

18.1 Test Environment

18.2 Antennas Versus Probes

18.3 Common-Mode Currents on Cables

    18.3.1 Test Procedure

    18.3.2 Cautions

18.4 Near Field Measurements

    18.4.1 Test Procedure

    18.4.2 Cautions

18.4.3 Seams and Apertures in Enclosures

18.5 Noise Voltage Measurements

    18.5.1 Balanced Differential Probe

    18.5.2 DC to 1-GHz Probe

    18.5.3 Cautions

18.6 Conducted Emission Testing

    18.6.1 Test Procedure

    18.6.2 Cautions

    18.6.3 Separating C-M From D-M Noise

18.7 Spectrum Analyzers

    18.7.1 Detector Functions

    18.7.2 General Test Procedure

18.8 EMC Crash Cart

    18.8.1 Mitigation Parts List

18.9 One-Meter Radiated Emission Measurements

    18.9.1 Test Environment

    18.9.2 Limits For 1-m Testing

    18.9.3 Antennas For 1-m Testing

18.10 Precompliance Immunity Testing

    18.10.1 Radiated Immunity

    18.10.2 Conducted Immunity

    18.10.3 Transient Immunity

18.11 Precompliance Power Quality Tests

    18.11.1 Harmonics

    18.11.2 Flicker

18.12 Margin

    18.12.1 Radiated Emission Margin

    18.12.2 Electrostatic Discharge Margin

Summary

Problems

References

Further Reading

Appendix A. The Decibel

A.1 Properties of Logarithms

A.2 Using the Decibel for Other Than Power Measurements

A.3 Power Loss or Negative Power Gain

A.4 Absolute Power Level

A.5 Summing Powers Expressed in Decibels   

B. The Ten Best Ways to Maximize the Emission          from Your Product C. Multiple Reflections of Magnetic Fields in               Thin Shields D. Dipoles for Dummies

D.1 Basic Dipoles for Dummies

D.2 Intermediate Dipoles for Dummies

D.3 Advanced Dipoles for Dummies

    D.3.1 Impedance of a Dipole

    D.3.2 Dipole Resonance

    D.3.3 Receiving Dipole

    D.3.4 Theory of Images

    D.3.5 Dipole Arrays

    D.3.6 Very High-Frequency Antennas

Summary

Further Reading

E. Partial Inductance

E.1 Inductance

E.2 Loop Inductance

    E.2.1 Inductance of a Rectangular Loop

E.3 Partial Inductance

    E.3.1 Partial Self-Inductance

    E.3.2 Partial Mutual-Inductance

    E.3.3 Net Partial Inductance

    E.3.4 Partial Inductance Applications

        E.3.4.1 Rectangular Loop

        E.3.4.2 Two Unequal Diameter Parallel Conductors

    E.3.5 Transmission Line Example

E.4 Ground Plane Inductance Measurement Test Setup

E.5 Inductance Notation

Summary

References

Further Reading

F. Answers to Problems Index

A few of my friends were postulating how old Henry must be these days, one pal said he must be in his 80s, I said he is in his 60s. I asked Henry about that and he said: “Your all wrong about my age, it’s in the mid 70’s.” I hope all of us are jetting around the country and writing books when we are in our mid 70s. It is an honor to know someone that will take the time to compile a lifetime’s worth of learning and experience and sell it for cheap. He could keep all this secret and just charge consultation fees, but once you meet Henry, you realize he is an engineer’s engineer, and he is fundamentally offended by EMC and noise and wants to stamp it out forever. Buy the book and do your part.