Microprocessor Forum: Intel Questions IBM Air Gap Dielectric for On-Chip Interconnect

Mark Bohr, an Intel Fellow and keynote speaker at the Microprocessor Forum, answered a question about IBM’s recently announced air-gap dielectric for on-chip interconnect technology by stating that there were two problems with the technology from his perspective. First, he said, the published information suggests that the technology doubles the number of interconnect masks and interconnect already accounts for more than half of a microprocessor’s manufacturing cost. Second, he reiterated a previously stated Intel position that the air gaps reduce the mechanical reliability of the chip.

Click here for Ed Sperling's audiocast interview with Intel's Mark Bohr on this topic.