LED metal substrates get sticky with thermally conductive adhesive

Bergquist sent me a sample of its Bond Ply 450 thermal interface material combined with its Thermal Clad metal substrate for LED assemblies.

The peel-and-stick aspect of mounting an LED substrate is attractive for ease of assembly, but sticky-mounting approaches usually have two drawbacks: The sticky-ness degrades during the heat of solder reflow, and the sticky stuff generally acts as an insulator, a very bad characteristic when your goal is to draw the heat out of the LED substrate.

The Bond Ply 450 PA withstands solder temperatures, and has a low thermal impedance of 0.87C-in2/W.

If you’re interested in thermal design challenges for HB LEDs, register for EDN’s LED Workshop,  April 30 in Santa Clara.

You can follow my LED/thermal micro-posts here: http://twitter.com/margeryc.